Method for manufacturing a multilayer circuit board

A method for manufacturing a multilayer circuit board, comprising:

• providing an inner circuit substrate, wherein the inner circuit substrate is provided with a first surface and a second surface opposite to the first surface;
• forming a through hole penetrating the first surface and the second surface;
• attaching a support plate to the second surface to seal an opening of the through hole;
• providing an electronic module, wherein the electronic module is provided with a main body, at least one electronic component, a first adhesive layer, and a second adhesive layer, the main body defining a groove, the at least one electronic component is fixed to a bottom wall of the groove through the first adhesive layer, the second adhesive layer infilling the groove, and the first adhesive layer and the second adhesive layer jointly encapsulates the at least one electronic component;
• placing the electronic module in the through hole, wherein the electronic module is bonded to the support plate;
• pressing a first substrate onto the first surface;
• removing the support plate;
• pressing a second substrate onto the second surface, the first substrate and the second substrate infilling the through hole and jointly encapsulating the electronic module;
• and
• forming a first conductive wiring layer on a surface of the first substrate facing away from the first surface to obtain a first circuit substrate, and forming a second conductive wiring layer on a surface of the second substrate facing away from the second surface to obtain a second circuit substrate;
• wherein a surface of the second adhesive layer exposed from the groove is flush with a surface of the main body having the groove.