Method for manufacturing stub-free via hole, PCB, electronic device, and storage medium
AssigneeSuzhou Metabrain Intelligent Technology Co., Ltd.
InventorTianqi Yang
Life of this patent
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Abstract
Embodiments of the present disclosure relate to the technical field of PCBs, and in particular, relate to a method for manufacturing a stub-free via hole, a PCB, an electronic device, and a non-transitory readable storage medium. The method for manufacturing a stub-free via hole comprises: acquiring a target copper plating length of a to-be-opened via hole; forming a through-hole at a position of the to-be-opened via hole along a thickness direction of a PCB; blocking the through-hole to form a blind hole, so that a distance from a bottom of the blind hole to a surface of the PCB is equal to the target copper plating length; and performing copper plating on an inner wall of the blind hole to form a via hole.
Claims19
A method for manufacturing a stub-free via hole, the method comprising:
- acquiring a target copper plating length of a to-be-opened via hole;
- forming a through-hole at a position of the to-be-opened via hole along a thickness direction of a PCB;
- blocking the through-hole to form a blind hole, so that a distance from a bottom of the blind hole to a surface of the PCB is equal to the target copper plating length by:
- manufacturing an insertion member matching a shape of the through-hole and inserting the insertion member into the through-hole from a first surface of the PCB,
- wherein a length of the insertion member remaining in the through-hole is equal to the target copper plating length,
- and the first surface is a surface where the to-be-opened via hole intersects the PCB;
- from a second surface opposite the first surface, filling a region where the insertion member is not inserted into the through-hole with resin;
- and removing the insertion member from the through-hole to form the blind hole;
- and performing copper plating on an inner wall of the blind hole to form a via hole.
Dependencies are inferred from the claim text.