H05K 3/423
Characterised by electroplating method
Official title: {characterised by electroplating method}
H05K3/423 (Characterised by electroplating method) appears on 963 US grants and 941 published applications in this corpus.
Search patents in H05K- Granted patents
- 963
- Published applications
- 941
- Assignees
- 306
- Inventors
- 1,765
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 3 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 3 | 0 |
| 1985 | 1 | 0 |
| 1986 | 6 | 0 |
| 1987 | 3 | 0 |
| 1988 | 7 | 0 |
| 1989 | 7 | 0 |
| 1990 | 18 | 0 |
| 1991 | 13 | 0 |
| 1992 | 12 | 0 |
| 1993 | 12 | 0 |
| 1994 | 18 | 0 |
| 1995 | 21 | 0 |
| 1996 | 21 | 0 |
| 1997 | 21 | 0 |
| 1998 | 23 | 0 |
| 1999 | 28 | 0 |
| 2000 | 26 | 0 |
| 2001 | 33 | 14 |
| 2002 | 28 | 38 |
| 2003 | 26 | 46 |
| 2004 | 42 | 51 |
| 2005 | 31 | 59 |
| 2006 | 27 | 54 |
| 2007 | 32 | 44 |
| 2008 | 23 | 44 |
| 2009 | 26 | 39 |
| 2010 | 31 | 27 |
| 2011 | 33 | 31 |
| 2012 | 39 | 32 |
| 2013 | 18 | 13 |
| 2014 | 26 | 22 |
| 2015 | 19 | 18 |
| 2016 | 27 | 37 |
| 2017 | 25 | 30 |
| 2018 | 31 | 35 |
| 2019 | 35 | 39 |
| 2020 | 35 | 41 |
| 2021 | 32 | 17 |
| 2022 | 17 | 31 |
| 2023 | 18 | 23 |
| 2024 | 19 | 33 |
| 2025 | 24 | 20 |
| 2026 | 15 | 103 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Printed wiring board18 Aug 2026US 12,713,538 B2Ibiden Co., Ltd.
- Wiring substrate4 Aug 2026US 12,701,658 B2Ibiden Co., Ltd.
- Circuit board, electronic device having the circuit board and method of manufacturing the electronic device7 Jul 2026US 12,677,372 B2Quan Mei Technology Co., Ltd.
- Highly integrated power electronics and methods of manufacturing the same23 Jun 2026US 12,666,545 B2Toyota Motor Engineering & Manufacturing North America, Inc.
- Printed wiring board16 Jun 2026US 12,660,085 B2Ibiden Co., Ltd.
- Multi-layer circuit board and processing method therefor, chip system, and electronic device24 Sep 2026US 2026/0293001 A1Huawei Technologies Co., Ltd.
- Carbon-based direct plating process13 Aug 2026US 2026/0234828 A1
- Simultaneous Silicon Spring and Chip Singulation DRIE13 Aug 2026US 2026/0239987 A1
- High Current Column Grid Array Pillars13 Aug 2026US 2026/0240010 A1
- Targeted Jet-Cooling System for Zetta-Scale Computing Assemblies16 Jul 2026US 2026/0202891 A1
Most cited
By later US patents
- Apparatus and method for electrolytically depositing a metal on a microelectronic workpiece440US 6,197,181 B1Semitool, Inc. · 2001
- High-density electronic package, and method for making same437US 6,376,769 B1Amerasia International Technology, Inc. · 2002
- Method of manufacturing a semiconductor package336US 7,185,426 B1Amkor Technology, Inc. · 2007
- High-density, multi-level interconnects, flex circuits, and tape for tab285US 5,106,461 AMassachusetts Institute of Technology · 1992
- Interconnection method and structure for organic circuit boards248US 5,435,057 AInternational Business Machines Corporation · 1995