H05K 3/424
By direct electroplating
Official title: {by direct electroplating}
H05K3/424 (By direct electroplating) appears on 210 US grants and 120 published applications in this corpus.
Search patents in H05K- Granted patents
- 210
- Published applications
- 120
- Assignees
- 87
- Inventors
- 428
- Latest grant
- 19 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 5 | 0 |
| 1987 | 2 | 0 |
| 1988 | 5 | 0 |
| 1989 | 3 | 0 |
| 1990 | 11 | 0 |
| 1991 | 4 | 0 |
| 1992 | 6 | 0 |
| 1993 | 7 | 0 |
| 1994 | 6 | 0 |
| 1995 | 8 | 0 |
| 1996 | 10 | 0 |
| 1997 | 10 | 0 |
| 1998 | 9 | 0 |
| 1999 | 6 | 0 |
| 2000 | 6 | 0 |
| 2001 | 5 | 0 |
| 2002 | 3 | 3 |
| 2003 | 5 | 4 |
| 2004 | 3 | 3 |
| 2005 | 1 | 2 |
| 2006 | 2 | 4 |
| 2007 | 3 | 0 |
| 2008 | 1 | 1 |
| 2009 | 0 | 3 |
| 2010 | 1 | 3 |
| 2011 | 2 | 2 |
| 2012 | 0 | 1 |
| 2013 | 2 | 3 |
| 2014 | 2 | 4 |
| 2015 | 3 | 4 |
| 2016 | 6 | 15 |
| 2017 | 3 | 9 |
| 2018 | 14 | 13 |
| 2019 | 13 | 11 |
| 2020 | 11 | 12 |
| 2021 | 7 | 5 |
| 2022 | 4 | 5 |
| 2023 | 6 | 5 |
| 2024 | 3 | 3 |
| 2025 | 5 | 3 |
| 2026 | 2 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Single step electrolytic method of filling through-holes in printed circuit boards and other substrates19 May 2026US 12,635,082 B2MacDermid Enthone Inc.
- Method of manufacturing multi-layer circuit board including extreme fine via and multi-layer circuit board manufactured by the same7 Apr 2026US 12,598,707 B2Tse Co., Ltd.
- Printed wiring board9 Dec 2025US 12,495,489 B2Ibiden Co., Ltd.
- Leveler compositions for use in copper deposition in manufacture of microelectronics26 Aug 2025US 12,398,480 B2MacDermid Enthone Inc.
- Complex waveform for electrolytic plating10 Jun 2025US 12,325,927 B2MacDermid Enthone Inc.
- Multi-layer circuit board and processing method therefor, chip system, and electronic device24 Sep 2026US 2026/0293001 A1Huawei Technologies Co., Ltd.
- Carbon-based direct plating process13 Aug 2026US 2026/0234828 A1
- High reliability ceramic circuit board and method for producing the same13 Nov 2025US 2025/0351265 A1Tong Hsing Electronic Industries, Ltd.
- Leveling agent, composition, and application thereof3 Jul 2025US 2025/0215598 A1Fudan University
- Printed wiring board20 Feb 2025US 2025/0063661 A1Sumitomo Electric Industries, Ltd.
Most cited
By later US patents
- G-tab manufacturing process and the product produced thereby189US 5,108,553 AOlin Corporation · 1992
- Printed circuit board through hole technique143US 4,964,948 AProtoCAD, Inc. · 1990
- Additive adhesive based process for the manufacture of printed circuit boards127US 4,581,301 A1986
- Plated through-holes in a printed circuit board68US 4,911,796 AProtoCAD, Inc. · 1990
- Fabrication of printed circuit boards using conducting polymer64US 5,300,208 AInternational Business Machines Corporation · 1994