G-tab manufacturing process and the product produced thereby
AssigneeOlin Corporation
InventorsCraig A. Foster, Randolfo Galvez, Kurt R. Raab
Life of this patent
Estimating the term…
Abstract
A thin, preferably flexible circuit having multiple conductive planes separated by a non-conductive layer is provided. Conductive vias electrically interconnect the conductive planes. The conductive vias comprise carbon coated blind vias which are made conductive by the electrolytic deposition of a metal on the carbon. The invention is particularly suited for G-TAB wherein a first metal plane is patterned into signal plane circuit traces and a second metal plane is patterned into ground plane traces.
Claims49
A method for manufacturing a thin circuit having electrically interconnecting first and second conductive planes separated by a non-conductive layer, comprising the steps of:
- (a) patterning said first and second conductive planes into circuit traces comprising a signal plane and a ground plane, respectively;
- (b) connecting said first and second conductive planes with at least one non-conductive blind hole via;
- (c) depositing a dispersion of carbon black on the walls of said non-conductive via;
- and
- (d) depositing a conductive metal onto said carbon black dispersion to establish electrical conductivity.
A method for manufacturing a thin circuit having electrically interconnecting first and second conductive planes separated by a non-conductive layer, comprising the steps of:
- (a) patterning said first and second conductive planes into circuit traces comprising a signal plane and a ground plane, respectively;
- (b) connecting said first and second conductive planes with at least one non-conductive hole via having a diameter of up to about 5 mils;
- (c) depositing a dispersion of carbon black on the walls of said non-conductive via;
- and
- (d) depositing a conductive metal onto said carbon black dispersion to establish electrical conductivity.
A method for manufacturing a thin circuit having electrically interconnecting first and second conductive planes separated by a non-conductive layer, comprising the steps of:
- (a) connecting said first and second conductive planes with at least one non-conductive via which extends from an aperture in said second conductive plane to said first conductive plane;
- (b) depositing a dispersion of carbon black on the walls of said non-conductive via;
- (c) coating substantially all surfaces of said thin circuit with a plating resist except for the walls of said non-conductive via and a region adjacent to said aperture;
- and
- (d) depositing a conductive metal onto said carbon black dispersion to establish electrical conductivity.
Dependencies are inferred from the claim text.