High reliability ceramic circuit board and method for producing the same

A high reliability ceramic circuit board, comprising:

• a ceramic substrate having a first surface and a second surface opposite to each other and having a through hole penetrating through the ceramic substrate;
• a copper pillar structure formed in the through hole of the ceramic substrate;
• a printed copper layer formed on the first surface and in contact with the copper pillar structure;
• and
• two direct plated copper (DPC) structures respectively formed on the printed copper layer and the second surface of the ceramic substrate, wherein each of the two direct plated copper (DPC) structures includes a sputtered layer, a chemical plated copper layer, and an electroplated copper layer, the chemical plated copper layer is arranged between the sputtered layer and the electroplated copper layer, and the sputtered layer is disposed adjacent to the ceramic substrate.

A method for producing a high reliability ceramic circuit board, comprising:

• a preparing process implemented by providing a ceramic substrate having a first surface and a second surface opposite to each other and having a through hole penetrating through the ceramic substrate;
• a copper pillar structure forming process implemented by forming a copper pillar structure in the through hole of the ceramic substrate;
• a printing process implemented by forming two printed copper layers on the first surface and the second surface of the ceramic substrate in a printing manner;
• and
• a direct plating process implemented by forming two direct plated copper (DPC) structures on the two printed copper layers in a direct plating manner, wherein each of the two direct plated copper (DPC) structures includes a sputtered layer, a chemical plated copper layer, and an electroplated copper layer, the chemical plated copper layer is arranged between the sputtered layer and the electroplated copper layer, and the sputtered layer is disposed adjacent to the ceramic substrate.