Complex waveform for electrolytic plating
AssigneeMacDermid Enthone Inc.
InventorsDonald Desalvo, Ron Blake, Carmichael Gugliotti, William J. Decesare, Richard A. Bellemare, James Watkowski, Ernest Long
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AssigneeMacDermid Enthone Inc.
InventorsDonald Desalvo, Ron Blake, Carmichael Gugliotti, William J. Decesare, Richard A. Bellemare, James Watkowski, Ernest Long
Estimating the term…
A method of copper electroplating in the manufacture of printed circuit boards. The method is used for filling through-holes and blind micro-vias with copper. The method includes the steps of: (1) preparing an electronic substrate to. receive copper electroplating thereon; (2) forming at least one of one or more through-holes and/or one or more blind micro-vias in the electronic substrate: and (3) electroplating copper in the at one or more through-holes and/or one or more blind micro-vias by contacting the electronic substrate with an acid copper electrolyte. The acid copper electrolyte is used to plate the one or more through-holes and/or the one or more blind micro-vias using a complex waveform including pulse reverse plating, DC plating and/or synchronous pulse plating. The complex waveforms can be used for filling through-holes and blind microvias with copper without defects.
A method of plating a metal on an electronic substrate, wherein the electronic substrate comprises one or more features, wherein the one or more features comprise one or more through-holes in the electronic substrate, the method comprising the steps of:
A method of plating a metal on an electronic substrate, wherein the electronic substrate comprises one or more features, wherein the one or more features comprise one or more through-holes in the electronic substrate, the method comprising the steps of:
Dependencies are inferred from the claim text.