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US 4,911,796 AGranted
Plated through-holes in a printed circuit board
AssigneeProtoCAD, Inc.
InventorRonald G. Reed
Life of this patent
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AssigneeProtoCAD, Inc.
InventorRonald G. Reed
Estimating the term…
A process of forming plates through-holes in a printed circuit board involves placing a film of fluid ink having electrically conductive properties on a side wall of the hole, curing the film to a solid and electroplating a layer of metal on the conductive ink film. The conductive ink preferably is a composition including conductive particles such as carbon and silver flakes. The ink also preferably includes a thermosetting or radiation curable binder and a thinner. The film of ink is cured before the layer of metal is electroplated thereon. The plated through-hole is protected from the etchant when the conductors are etched by placing a radiation curable putty material into the hole, curing it, and then depositing a layer of resist on top of the cured putty and a conductive sheet clad to the substrate of the circuit board.
A process for electroplating a metallic layer on a side wall of a hold formed in a conductor clad board to produce a plated through-hole in a printed circuit board, comprising the steps of:
A process for electroplating a metallic layer on a side wall of a hole formed in a conductor clad board to produce a plated through-hole in a printed circuit board, comprising the steps of:
Dependencies are inferred from the claim text.