Highly integrated power electronics and methods of manufacturing the same
AssigneeToyota Motor Engineering & Manufacturing North America, Inc.
InventorsFeng Zhou, Tianzhu Fan, Ercan Mehmet Dede
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Abstract
A method for high volume manufacture of highly integrated power electronics embedded printed circuit board (PCB)-cold plate assemblies includes bonding a power device fabrication panel to a multi-layer PCB, drilling via passageways in the multi-layer PCB, and electroplating a conductive metal into the vias before bonding the power device fabrication panel to a plurality of cold plates and forming an IPEs embedded PCB-cold plate fabrication panel. The method also includes cutting the IPEs embedded PCB-cold plate fabrication panel into a plurality of highly IPEs embedded PCB-cold plate assemblies.
Claims20
A method comprising:
- bonding a power device fabrication panel to a multi-layer printed circuit board (PCB);
- drilling via passageways in the multi-layer PCB;
- electroplating a conductive metal into the via passageway;
- bonding a plurality of cold plates to the power device fabrication panel and forming an integrated power electronics (IPEs) embedded PCB-cold plate fabrication panel;
- and
- cutting the IPEs embedded PCB-cold plate fabrication panel into a plurality of highly IPEs embedded PCB-cold plate assemblies that individually include an IPEs embedded PCB attached to and in thermal communication with a cold plate comprising a fluid chamber having at least one of an inlet and an outlet formed in a lower wall of the cold plate.
A method comprising:
- laminating a multi-layer printed circuit board (PCB) onto a power device fabrication panel via a low thermal resistance dielectric layer;
- drilling via passageways in the multi-layer PCB;
- electroplating copper into the via passageways;
- bonding the multi-layer PCB to a cold plate fabrication panel and forming an integrated power electronics (IPEs) embedded PCB-cold plate fabrication panel;
- and
- cutting the IPEs embedded PCB-cold plate fabrication panel into a plurality of highly IPEs embedded PCB-cold plate assemblies that individually include an IPEs embedded PCB attached to and in thermal communication with a cold plate comprising a fluid chamber having at least one of an inlet and an outlet formed in a lower wall of the cold plate.
A method comprising:
- laminating a multi-layer printed circuit board (PCB) onto a power device fabrication panel via a low thermal resistance dielectric layer;
- drilling via passageways in the multi-layer PCB;
- electroplating copper into the via passageways;
- bonding a plurality of cold plate substrates directly to a plurality of a power devices embedded in the power device fabrication panel;
- bonding a plurality of 3D printed cold plate manifolds to the power device fabrication panel and forming an integrated power electronics (IPEs) embedded PCB-cold plate fabrication panel;
- and
- cutting the IPEs embedded PCB-cold plate fabrication panel into a plurality of highly IPEs embedded PCB-cold plate assemblies that individually include an IPEs embedded PCB attached to and in thermal communication with a fluid chamber of a cold plate manifold comprising and at least one of an inlet and an outlet formed in a lower wall thereof.
Dependencies are inferred from the claim text.