H05K 3/46
Manufacturing multilayer circuits
H05K3/46 (Manufacturing multilayer circuits) appears on 11,335 US grants and 11,901 published applications in this corpus.
Search patents in H05K- Granted patents
- 11,335
- Published applications
- 11,901
- Assignees
- 2,311
- Inventors
- 17,753
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 22 | 0 |
| 1977 | 13 | 0 |
| 1978 | 12 | 0 |
| 1979 | 9 | 0 |
| 1980 | 14 | 0 |
| 1981 | 26 | 0 |
| 1982 | 25 | 0 |
| 1983 | 27 | 0 |
| 1984 | 32 | 0 |
| 1985 | 48 | 0 |
| 1986 | 45 | 0 |
| 1987 | 74 | 0 |
| 1988 | 77 | 0 |
| 1989 | 97 | 0 |
| 1990 | 98 | 0 |
| 1991 | 109 | 0 |
| 1992 | 140 | 0 |
| 1993 | 120 | 0 |
| 1994 | 125 | 0 |
| 1995 | 144 | 0 |
| 1996 | 132 | 0 |
| 1997 | 123 | 0 |
| 1998 | 200 | 0 |
| 1999 | 202 | 0 |
| 2000 | 188 | 0 |
| 2001 | 250 | 126 |
| 2002 | 285 | 371 |
| 2003 | 302 | 365 |
| 2004 | 326 | 458 |
| 2005 | 240 | 431 |
| 2006 | 262 | 479 |
| 2007 | 298 | 516 |
| 2008 | 296 | 622 |
| 2009 | 273 | 622 |
| 2010 | 417 | 518 |
| 2011 | 402 | 485 |
| 2012 | 442 | 406 |
| 2013 | 370 | 413 |
| 2014 | 357 | 565 |
| 2015 | 376 | 576 |
| 2016 | 466 | 531 |
| 2017 | 459 | 454 |
| 2018 | 442 | 443 |
| 2019 | 481 | 509 |
| 2020 | 441 | 501 |
| 2021 | 425 | 435 |
| 2022 | 393 | 463 |
| 2023 | 340 | 477 |
| 2024 | 353 | 448 |
| 2025 | 339 | 393 |
| 2026 | 198 | 294 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 3/4644By building the multilayer layer by layer, i.e. build-up multilayer circuits5,422
- H05K 3/4611By laminating two or more circuit boards4,010
- H05K 3/4602Characterized by a special circuit board as base or central core whereon1,963
- H05K 3/4688Composite multilayer circuits, i.e. comprising insulating layers having different properties1,494
- H05K 3/4697Having cavities806
- H05K 3/4685Manufacturing of cross-over conductors273
Recent patents
- Buried skip vias for improved signal and power integrity6 Oct 2026US 12,757,327 B2NVIDIA Corporation
- Method for integrating a copper-graphene laminate (CGL) in a multilayer PCB fabrication process6 Oct 2026US 12,757,335 B2Bar-Ilan University
- Circuit board and manufacturing method thereof29 Sep 2026US 12,750,957 B2Avary Holding (Shenzhen) Co., Limited.
- Multilayer dielectric substrate and method for manufacturing multilayer dielectric substrate15 Sep 2026US 12,739,968 B2Murata Manufacturing Co., Ltd.
- Embedded inductor structure and manufacturing method thereof15 Sep 2026US 12,739,976 B2Unimicron Technology Corp.
- Microfluidic printed circuit board cooling8 Oct 2026US 2026/0313782 A1Microsoft Technology Licensing, LLC
- Method for manufacturing circuit board and circuit board8 Oct 2026US 2026/0313796 A1Resonac Corporation
- Wiring substrate and method for manufacturing wiring substrate8 Oct 2026US 2026/0313802 A1Ibiden Co., Ltd.
- Adhesive film, adhesive film with metal layer, wiring formation member, formation method for wiring layer, and wired member1 Oct 2026US 2026/0297391 A1Resonac Corporation
- Recyclable electronic device, and method and apparatus for manufacturing and recycling the device1 Oct 2026US 2026/0304602 A1Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
Most cited
By later US patents
- Two-layer capacitive touchpad and method of making same2,193US 6,188,391 B1Synaptics Incorporated · 2001
- Electroless CU deposition on a barrier layer by CU contact displacement for ULSI applications448US 5,891,513 ACornell Research Foundation, Inc. · 1999
- Rear electrode structures for displays432US 6,445,374 B2E Ink Corporation · 2002
- Method for producing coplanar multi-level metal/insulator films on a substrate and for forming patterned conductive lines simultaneously with stud vias406US 4,789,648 AInternational Business Machines Corporation · 1988
- Method for making an electronic module391US 5,745,984 AMartin Marietta Corporation · 1998