Method for manufacturing circuit board and circuit board

A method for manufacturing a circuit board, the circuit board comprising:

• a substrate including a first surface and a second surface located on a side opposite to the first surface;
• a first terminal formed on the first surface;
• and a second terminal formed on the second surface and electrically connected to the first terminal,
• the method comprising:
• preparing a glass laminate as the substrate,
• wherein the glass laminate, in which a plurality of glass layers are laminated, includes the first surface and the second surface;
• and
• irradiating the glass laminate with a laser light,
• wherein, in the preparing, the glass laminate is prepared in which the plurality of glass layers include a first outer glass layer including the first surface, and a first inner glass layer bonded to the first outer glass layer on a side opposite to the first surface,
• wherein, in the irradiating, a first hole is formed that penetrates at least the first outer glass layer and the first inner glass layer from the first surface toward the second surface by irradiating the first surface with the laser light, and
• wherein, a light absorptance of the first inner glass layer is lower than a light absorptance of the first outer glass layer.