H05K 3/4697
Having cavities
Official title: {having cavities, e.g. for mounting components (H05K3/4691 takes precedence)}
H05K3/4697 (Having cavities) appears on 806 US grants and 1,030 published applications in this corpus.
Search patents in H05K- Granted patents
- 806
- Published applications
- 1,030
- Assignees
- 304
- Inventors
- 1,880
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 3 | 0 |
| 1997 | 7 | 0 |
| 1998 | 4 | 0 |
| 1999 | 1 | 0 |
| 2000 | 4 | 0 |
| 2001 | 5 | 2 |
| 2002 | 4 | 11 |
| 2003 | 7 | 8 |
| 2004 | 7 | 10 |
| 2005 | 5 | 13 |
| 2006 | 3 | 18 |
| 2007 | 13 | 17 |
| 2008 | 10 | 27 |
| 2009 | 13 | 22 |
| 2010 | 15 | 21 |
| 2011 | 12 | 19 |
| 2012 | 17 | 17 |
| 2013 | 14 | 33 |
| 2014 | 18 | 61 |
| 2015 | 35 | 71 |
| 2016 | 50 | 90 |
| 2017 | 78 | 62 |
| 2018 | 78 | 61 |
| 2019 | 62 | 49 |
| 2020 | 57 | 53 |
| 2021 | 54 | 55 |
| 2022 | 46 | 58 |
| 2023 | 57 | 80 |
| 2024 | 45 | 61 |
| 2025 | 46 | 51 |
| 2026 | 25 | 60 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Multilayer dielectric substrate and method for manufacturing multilayer dielectric substrate15 Sep 2026US 12,739,968 B2Murata Manufacturing Co., Ltd.
- Multilayer substrate, electronic apparatus, and method for manufacturing multilayer substrate25 Aug 2026US 12,720,669 B2Murata Manufacturing Co., Ltd.
- Circuit board11 Aug 2026US 12,707,571 B2LG Innotek Co., Ltd.
- Printed circuit board21 Jul 2026US 12,690,137 B2Samsung Electro-Mechanics Co., Ltd.
- Method for manufacturing a multilayer circuit board14 Jul 2026US 12,684,698 B2Avary Holding (Shenzhen) Co., Limited.
- Dummy Body Embedded in a Component Carrier1 Oct 2026US 2026/0304633 A1AT&S (Chongqing) Company Limited
- Circuit board and package substrate comprising same17 Sep 2026US 2026/0282243 A1LG Innotek Co., Ltd.
- Circuit board and manufacturing method thereof27 Aug 2026US 2026/0255475 A1Avary Holding (Shenzhen) Co., Limited.
- Printed circuit board13 Aug 2026US 2026/0239529 A1Samsung Electro-Mechanics Co., Ltd.
- Printed circuit board, manufacturing method thereof, and electronic component package including the same13 Aug 2026US 2026/0239531 A1Samsung Electro-Mechanics Co., Ltd.
Most cited
By later US patents
- Methods of making multi-tier laminate substrates for electronic device packaging159US 5,798,014 AHestia Technologies, Inc. · 1998
- Printed wiring board and assembly of the same143US 6,324,067 B1Matsushita Electric Industrial Co., Ltd. · 2001
- Bear chip mounting printed circuit board and a method of manufacturing thereof by photoetching107US 5,831,833 ANEC Corporation · 1998
- Circuit boards using heat resistant resin for adhesive layers88US 6,121,553 AHitachi Chemical Company, Ltd. · 2000
- Printed circuit board with circuitized cavity and methods of producing same75US 6,214,525 B1International Business Machines Corporation · 2001