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US 2026/0304633 A1Published application
Dummy Body Embedded in a Component Carrier
AssigneeAT&S (Chongqing) Company Limited
InventorYuhui WU
Life of this patent
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Abstract
A component carrier includes a stack of at least one electrically conductive layer structure and a plurality of electrically insulating layer structures. A dummy body is embedded in a free region that is free of the at least one electrically conductive layer structure in the stack.
Claims20
A component carrier, comprising:
- a stack comprising at least one electrically conductive layer structure and a plurality of electrically insulating layer structures;
- a free region, being free of the at least one electrically conductive layer structure;
- and
- a dummy body, wherein the dummy body is embedded in the stack, wherein the dummy body is provided on or in at least one of the plurality of electrically insulating layer structures, and wherein the dummy body fills the free region.
1 more element
A method of manufacturing a component carrier, the method comprising:
- forming a stack comprising at least one electrically conductive layer structure and a plurality of electrically insulating layer structures;
- defining a free region, being free of the at least one electrically conductive layer structure;
- and
- embedding a dummy body in the stack, wherein the dummy body is provided on or in at least one of the plurality of electrically insulating layer structures, and wherein the dummy body fills the free region.
1 more element
Dependencies are inferred from the claim text.