Circuit board
AssigneeLG Innotek Co., Ltd.
InventorsChae Young You, Soo Min Lee, Jae Hun Jeong
Life of this patent
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Abstract
A circuit board according to an embodiment includes a first insulating layer; and a second insulating layer disposed on the first insulating layer and including a cavity; wherein the second insulating layer includes a lower surface of the cavity positioned higher than an upper surface of the first insulating layer, wherein the lower surface of the cavity includes: a plurality of first portions, and a plurality of second portions provided between the plurality of first portions and having a height different from that of the plurality of first portions, and wherein a height difference between a portion having a highest height and a portion having a lowest height of the plurality of first portions is 1 μm or less.
Claims20
A circuit board comprising:
- a first insulating layer;
- a second insulating layer disposed on the first insulating layer and including a cavity;
- and
- a circuit pattern layer disposed between the first insulating layer and the second insulating layer;
- wherein the circuit pattern layer includes a pad overlapping the cavity along a vertical direction,
- wherein a lower surface of the cavity includes a first portion and a second portion having steps from each other, and
- wherein an uppermost end of each of the first portion and the second portion is positioned lower than an upper surface of the pad.
Dependencies are inferred from the claim text.