Bear chip mounting printed circuit board and a method of manufacturing thereof by photoetching

A process for manufacturing a bare chip mounting multi-layer printed circuit board, comprising the steps of:

• (a) forming a wiring circuit conductor layer on at least one of an upper surface and a lower surface of a substrate;
• (b) entirely coating said one surface with an insulating layer containing a photosensitive resin;
• and
• (c) photoetching said insulating layer to form a recessed portion therein for receiving a bare chip.

A process for manufacturing a bare chip mounting multi-layer printed circuit board, comprising the steps of:

• (a) forming an inner wiring circuit conductor layer on at least one of an upper surface and a lower surface of a substrate;
• (b) entirely coating said one surface with an inner insulating layer;
• (c) forming a fine through hole in said insulating layer;
• (d) forming an outer wiring circuit conductor layer on said inner insulating layer;
• (e) rendering said through hole conductive for electrically connecting said inner wiring circuit conductor layer with said outer wiring circuit conductor layer;
• (f) coating the entire surface of said inner insulating layer with an outer insulating layer;
• and
• (g) photoetching said outer insulating layer to form a recessed portion therein for receiving a bare chip;
• wherein said outer insulating layer contains a photosensitive resin.

The process according to claim 61, wherein said photoetching step further comprises forming a step in said recessed portion by:

• forming a first opening in said outer insulating layer;
• and
• forming a second opening in said inner insulating layer;
• wherein said first opening is wider than said second opening.