Printed wiring board and assembly of the same
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorTousaku Nishiyama
Life of this patent
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Abstract
A printed wiring board (PWB) and assembly are described which are suitable for high density mounting of an electronic component and which can provide a thin and light assembly. A recess is formed in one part of a PWB and components are received in this recess. The components are lower than the surface of the PWB. A conductive pad is provided to the bottom of the recess and a connecting terminal and the conductive pad are electrically connected by using a solder ball or a conductive adhesive material. The recess is formed by partially removing one or more layers of plural conductive layers and insulating layers which make up the multilayer PWB.
Claims4
A printed wiring board assembly, comprising an electrical component and a multi-layered printed wiring board, said electrical component being placed in a recess formed in the multi-layered printed wiring board, said multi-layered printed wiring board comprising conductive layers and a plurality of insulating resin-based layers laminated alternately with said conductive layers and having a via hole formed therein, wherein
- a connecting terminal is provided on a bottom portion of the electrical component which is electrically connected to a conductive pad within said recess by means of a two-stage protruding electrode and a conductive adhesive material, and
- said conductive pad is electrically connected to said via hole.
Dependencies are inferred from the claim text.