US 2026/0239529 A1 · PRINTED CIRCUIT BOARD

Abstract

The present disclosure relates to a printed circuit board including: a glass layer; a first wiring portion disposed on the glass layer; and a second wiring portion disposed on the first wiring portion. The first wiring portion includes one or more inorganic insulating layers, one or more first wiring layers respectively disposed on or within the one or more inorganic insulating layers, and one or more first wiring vias respectively disposed within the one or more inorganic insulating layers. The second wiring portion includes one or more first organic insulating layers, one or more second wiring layers respectively disposed on or within the one or more first organic insulating layers, and one or more second wiring vias respectively disposed within the one or more first organic insulating layers. The second wiring portion has a cavity penetrating through at least a portion of the one or more first organic insulating layers.

Claims26

Dependent claims

A printed circuit board, comprising:

a glass layer;
a first wiring portion disposed on an upper side of the glass layer;
and
a second wiring portion disposed on an upper side of the first wiring portion,
wherein the first wiring portion includes one or more inorganic insulating layers, one or more first wiring layers respectively disposed on or within the one or more inorganic insulating layers, and one or more first wiring vias respectively disposed within the one or more inorganic insulating layers, and
the second wiring portion includes one or more first organic insulating layers, one or more second wiring layers respectively disposed on or within the one or more first organic insulating layers, and one or more second wiring vias respectively disposed within the one or more first organic insulating layers, and has a cavity penetrating through at least a portion of the one or more first organic insulating layers.

3 more elements

A printed circuit board, comprising:

a glass layer;
a first substrate portion disposed on an upper side of the glass layer;
and
a second substrate portion disposed on an upper side of the first substrate portion, the second substrate portion including a first region having a cavity and a second region surrounding the first region,
wherein the first substrate portion includes a first insulating body including an inorganic insulating material and one or more first conductive pattern layers respectively disposed on or within the first insulating body,
the second wiring portion includes a second insulating body including an organic insulating material and one or more second conductive pattern layers respectively disposed on or within the second insulating body, and
the one or more second conductive pattern layers are disposed in the second region.

4 more elements

Dependencies are inferred from the claim text.

Printed circuit board

Life of this patent

Printed circuit board

Life of this patent

Abstract

Claims26