Back to results
US 5,798,014 AGranted
Methods of making multi-tier laminate substrates for electronic device packaging
AssigneeHestia Technologies, Inc.
InventorPatrick O. Weber
Life of this patent
Estimating the term…
Abstract
A method for making multi-tier laminate substrates for electronic device packaging is provided wherein a spacing mechanism is used to protect the bond fingers of a trace on a lower tier of the laminated substrate when a milling bit is used to cut an opening above a die cavity in the multi-tier substrate.
Claims15
A method for making multi-tier laminate substrates for electronic device packaging comprising the steps of:
- providing a first laminating layer having a trace on a first side and a second laminating layer having a trace on a first side;
- making an annular depression in the first side of the first laminating layer;
- making a first window corresponding to the annular depression in at least one layer of dielectric;
- laminating together the first laminating layer, the second laminating layer, and the layer of dielectric to produce a laminated substrate, wherein the layer of dielectric is located between the trace on the first side of the first laminating layer and the trace on the first side of the second laminating layer;
- making vias through the laminated substrate;
- plating the vias;
- producing traces on a second side of the first laminating layer and a second side of the second laminating layer;
- making a first opening in the first laminating layer corresponding to the annular depression;
- and
- treating exposed surfaces of the laminating layers.
7 more elements
Dependencies are inferred from the claim text.