H05K 3/4602
Characterized by a special circuit board as base or central core whereon
Official title: {characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated}
H05K3/4602 (Characterized by a special circuit board as base or central core whereon) appears on 1,963 US grants and 2,405 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,963
- Published applications
- 2,405
- Assignees
- 441
- Inventors
- 3,362
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 4 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 4 | 0 |
| 1989 | 5 | 0 |
| 1990 | 5 | 0 |
| 1991 | 3 | 0 |
| 1992 | 9 | 0 |
| 1993 | 6 | 0 |
| 1994 | 7 | 0 |
| 1995 | 17 | 0 |
| 1996 | 16 | 0 |
| 1997 | 9 | 0 |
| 1998 | 10 | 0 |
| 1999 | 11 | 0 |
| 2000 | 17 | 0 |
| 2001 | 31 | 33 |
| 2002 | 63 | 73 |
| 2003 | 54 | 80 |
| 2004 | 72 | 102 |
| 2005 | 62 | 90 |
| 2006 | 48 | 99 |
| 2007 | 60 | 119 |
| 2008 | 77 | 168 |
| 2009 | 71 | 166 |
| 2010 | 106 | 136 |
| 2011 | 121 | 138 |
| 2012 | 140 | 118 |
| 2013 | 103 | 98 |
| 2014 | 118 | 131 |
| 2015 | 86 | 118 |
| 2016 | 85 | 89 |
| 2017 | 94 | 53 |
| 2018 | 56 | 53 |
| 2019 | 48 | 70 |
| 2020 | 62 | 65 |
| 2021 | 63 | 69 |
| 2022 | 47 | 58 |
| 2023 | 51 | 71 |
| 2024 | 42 | 67 |
| 2025 | 48 | 74 |
| 2026 | 22 | 67 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method for integrating a copper-graphene laminate (CGL) in a multilayer PCB fabrication process6 Oct 2026US 12,757,335 B2Bar-Ilan University
- Printed wiring board manufacturing method and processing system8 Sep 2026US 12,733,111 B2Ibiden Co., Ltd.
- Circuit board11 Aug 2026US 12,707,559 B2LG Innotek Co., Ltd.
- Circuit board and method for manufacturing the same21 Jul 2026US 12,690,140 B2Samsung Electro-Mechanics Co., Ltd.
- Wiring board structure21 Jul 2026US 12,690,141 B2Unimicron Technology Corp.
- Forming a circuit bearing structure with low temperature and pressure during lamination cycle1 Oct 2026US 2026/0304636 A1LCP Medical Technologies, Inc.
- Low dielectric resin composition, adhesiveness-imparting agent, low dielectric adhesive composition, low dielectric adhesive molded product, low dielectric adhesive, and laminate3 Sep 2026US 2026/0258237 A1Mitsui Chemicals, Inc.
- Devices including capacitor coupling power path to ground path and associated components and systems20 Aug 2026US 2026/0247959 A1Microchip Technology Incorporated
- Printed circuit board13 Aug 2026US 2026/0239529 A1Samsung Electro-Mechanics Co., Ltd.
- Component Carrier and Method of Manufacturing the Same13 Aug 2026US 2026/0239535 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Most cited
By later US patents
- High density chip carrier with integrated passive devices321US 7,030,481 B2Internation Business Machines Corporation · 2006
- High density chip carrier with integrated passive devices303US 6,962,872 B2International Business Machines Corporation · 2005
- Component built-in module and method for producing the same277US 6,734,542 B2Matsushita Electric Industrial Co., Ltd. · 2004
- Method for producing multilayer printed wiring boards247US 5,258,094 ANEC Corporation · 1993
- Planar redistribution structure and printed wiring device239US 5,774,340 AInternational Business Machines Corporation · 1998