H05K 3/4608
Comprising an electrically conductive base or core
Official title: {comprising an electrically conductive base or core}
H05K3/4608 (Comprising an electrically conductive base or core) appears on 234 US grants and 298 published applications in this corpus.
Search patents in H05K- Granted patents
- 234
- Published applications
- 298
- Assignees
- 125
- Inventors
- 542
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 4 | 9 |
| 2002 | 6 | 8 |
| 2003 | 5 | 12 |
| 2004 | 11 | 11 |
| 2005 | 5 | 5 |
| 2006 | 6 | 5 |
| 2007 | 3 | 11 |
| 2008 | 7 | 13 |
| 2009 | 5 | 18 |
| 2010 | 6 | 12 |
| 2011 | 10 | 10 |
| 2012 | 16 | 20 |
| 2013 | 7 | 15 |
| 2014 | 13 | 13 |
| 2015 | 12 | 15 |
| 2016 | 8 | 19 |
| 2017 | 15 | 12 |
| 2018 | 9 | 10 |
| 2019 | 12 | 14 |
| 2020 | 9 | 13 |
| 2021 | 15 | 12 |
| 2022 | 8 | 6 |
| 2023 | 6 | 14 |
| 2024 | 8 | 11 |
| 2025 | 6 | 4 |
| 2026 | 5 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for integrating a copper-graphene laminate (CGL) in a multilayer PCB fabrication process6 Oct 2026US 12,757,335 B2Bar-Ilan University
- Circuit board and method for manufacturing the same21 Jul 2026US 12,690,140 B2Samsung Electro-Mechanics Co., Ltd.
- Wiring component for electrical equipment21 Apr 2026US 12,609,517 B2Mitsubishi Electric Corporation
- Printed wiring board3 Feb 2026US 12,543,273 B2Ibiden Co., Ltd.
- Electronic device13 Jan 2026US 12,522,716 B2Ticona LLC
- Power semiconductor module and method for producing same23 Jul 2026US 2026/0214807 A1Schweizer Electronic AG
- Systems and methods for high-stiffness substrate integration in semiconductor packages16 Jul 2026US 2026/0206130 A1Avago Technologies International Sales Pte. Limited
- Embedding resin, circuit board, electronic module, and method for manufacturing circuit board25 Jun 2026US 2026/0182471 A1NHK Spring Co., Ltd.
- Printed wiring board30 Apr 2026US 2026/0122793 A1Ibiden Co., Ltd.
- Semiconductor module and insert molding method19 Mar 2026US 2026/0082485 A1Fuji Electric Co., Ltd.
Most cited
By later US patents
- Circuit board structure with embedded electronic components111US 7,639,473 B2Phoenix Precision Technology Corporation · 2009
- Multi-layered interconnect structure using liquid crystalline polymer dielectric96US 7,301,108 B2International Business Machines Corporation · 2007
- Metal core multilayer resin wiring board with thin portion and method for manufacturing the same75US 6,323,439 B1Ngk Spark Plug Co., Ltd. · 2001
- Advanced polymers on metal printed wiring board70US 4,963,697 ATexas Instruments Incorporated · 1990
- Thermal interface for a printed wiring board59US 4,882,454 ATexas Instruments Incorporated · 1989