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US 4,882,454 AGranted
Thermal interface for a printed wiring board
AssigneeTexas Instruments Incorporated
InventorsRobert K. Peterson, Larry J. Mowatt, Aaron D. Poteet
Life of this patent
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Abstract
A printed wiring board is comprised of a combination of layers providing a good thermal match with surface mount components. The board consists of a core surrounded by multiple layers of dielectric and conductive materials optimized for their thermal expansion qualities. The core is also used as a heat sink for drawing excess heat from the components. An integral thermal interface region is used to dissipate the heat from the core.
Claims17
A printed wiring board for mounting components thereto, said printed wiring board including:
- a thermally conductive core;
- and
- a first thermal interface region having a first outer surface, said first thermal interface disposed over and in thermal contact with said core for conducting heat generated by said components to said core via said first thermal interface region;
- said first thermal interface region having a plurality of interlaced thermally insulating and thermally conductive layers, one of said thermally conductive layers being disposed on said first outer surface, and plural thermally conductive vias, each said via coupled to an adjacent pair of said thermally conductive layers extending from said thermally conductive core to said thermally conductive layer on said first outer surface of said first thermal interface region.
1 more element
Dependencies are inferred from the claim text.