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US 2026/0258237 A1Published application
Low dielectric resin composition, adhesiveness-imparting agent, low dielectric adhesive composition, low dielectric adhesive molded product, low dielectric adhesive, and laminate
AssigneeMitsui Chemicals, Inc.
InventorsNatsuki SAKAMOTO, Yoshihito HIROTA
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Abstract
A low dielectric resin composition includes a polyolefin-based resin. The polyolefin-based resin includes a styrene-based elastomer (A) and a cyclic olefin-based polymer (B) having an alicyclic ring in a main chain. A content ratio of the styrene-based elastomer (A) is 30 parts by mass or more and 89 parts by mass or less with respect to 100 parts by mass of the total amount of the styrene-based elastomer (A) and the cyclic olefin-based polymer (B).
Claims14
A low dielectric resin composition comprising:
- a polyolefin-based resin, wherein
- the polyolefin-based resin includes
- a styrene-based elastomer (A) and
- a cyclic olefin-based polymer (B) having an alicyclic ring in a main chain, and
- a content ratio of the styrene-based elastomer (A) is 30 parts by mass or more and 89 parts by mass or less with respect to 100 parts by mass of the total amount of the styrene-based elastomer (A) and the cyclic olefin-based polymer (B).
2 more elements
Dependencies are inferred from the claim text.