H05K 3/4605
Made from inorganic insulating material
Official title: {made from inorganic insulating material}
H05K3/4605 (Made from inorganic insulating material) appears on 230 US grants and 308 published applications in this corpus.
Search patents in H05K- Granted patents
- 230
- Published applications
- 308
- Assignees
- 94
- Inventors
- 697
- Latest grant
- 21 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 5 | 0 |
| 1993 | 2 | 0 |
| 1994 | 3 | 0 |
| 1995 | 6 | 0 |
| 1996 | 3 | 0 |
| 1997 | 4 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 3 | 0 |
| 2001 | 2 | 3 |
| 2002 | 10 | 7 |
| 2003 | 4 | 7 |
| 2004 | 5 | 5 |
| 2005 | 4 | 6 |
| 2006 | 3 | 8 |
| 2007 | 5 | 3 |
| 2008 | 5 | 10 |
| 2009 | 1 | 0 |
| 2010 | 9 | 8 |
| 2011 | 3 | 14 |
| 2012 | 5 | 7 |
| 2013 | 10 | 9 |
| 2014 | 9 | 11 |
| 2015 | 10 | 21 |
| 2016 | 7 | 15 |
| 2017 | 12 | 9 |
| 2018 | 9 | 13 |
| 2019 | 7 | 13 |
| 2020 | 18 | 18 |
| 2021 | 14 | 16 |
| 2022 | 9 | 11 |
| 2023 | 8 | 14 |
| 2024 | 11 | 18 |
| 2025 | 8 | 30 |
| 2026 | 5 | 32 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Printed circuit board and method of manufacturing the same21 Apr 2026US 12,610,462 B2Samsung Electro-Mechanics Co., Ltd.
- Wiring board10 Mar 2026US 12,575,029 B2Toppan Inc.
- Manufacturing method of circuit board structure24 Feb 2026US 12,563,667 B2Unimicron Technology Corp.
- Wiring substrate10 Feb 2026US 12,550,254 B2Kioxia Corporation
- Radio-frequency circuit for phased array antenna3 Feb 2026US 12,543,259 B2Tron Future Tech Inc.
- Printed circuit board13 Aug 2026US 2026/0239529 A1Samsung Electro-Mechanics Co., Ltd.
- Component Carrier and Method of Manufacturing the Same13 Aug 2026US 2026/0239535 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Component Carrier and Method of Manufacturing the Same13 Aug 2026US 2026/0239538 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Glass Barrier Layer Product, and Manufacture Method30 Jul 2026US 2026/0223288 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Hybrid circuit board23 Jul 2026US 2026/0214793 A1Tong Hsing Electronic Industries, Ltd.
Most cited
By later US patents
- Selective plating method for forming integral via and wiring layers210US 5,209,817 AInternational Business Machines Corporation · 1993
- Method for fabricating microbump interconnect for bare semiconductor dice166US 5,789,271 AMicron Technology, Inc. · 1998
- Thick film and thin film composite substrate and electronic circuit apparatus using it137US 5,110,664 AHitachi, Ltd. · 1992
- Multilayered glass-ceramic substrate for mounting of semiconductor device111US 4,221,047 AInternational Business Machines Corporation · 1980
- Microelectronic circuit substrate structure including photoimageable epoxy dielectric layers100US 5,485,038 AHughes Aircraft Company · 1996