Manufacturing method of circuit board structure

A manufacturing method of a circuit board structure, comprising:

• forming a glass substrate, wherein the glass substrate comprises an electrode layer, and the electrode layer is located on the glass substrate;
• forming a first sub-circuit board, wherein the first sub-circuit board comprises a conductive through hole;
• and
• laminating the glass substrate, the first sub-circuit board and a first redistribution layer such that the first sub-circuit board is located between the glass substrate and the first redistribution layer, wherein the conductive through hole electrically connects to the electrode layer and the first redistribution layer,
• wherein before laminating the glass substrate, the first sub-circuit board and the first redistribution layer, the first sub-circuit board is in a B-stage state, and the method further comprises performing a hot pressing method to transform the first sub-circuit board from the B-stage state to a C-stage state after laminating the glass substrate, the first sub-circuit board and the first redistribution layer.