Printed circuit board and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsSang Min Ahn, Gyoo Tae Bae
Life of this patent
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AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsSang Min Ahn, Gyoo Tae Bae
Estimating the term…
A printed circuit board includes a glass layer having a first side surface and a second side surface, opposing each other in a first direction, a third side surface and a fourth side surface, opposing each other in a second direction, a first corner portion connecting the first side surface and the third side surface to each other, a second corner portion connecting the first side surface and the fourth side surface to each other, a third corner portion connecting the second side surface and the third side surface to each other, and a fourth corner portion connecting the second side surface and the fourth side surface to each other; a first insulating layer covering at least a portion of at least one side surface of the first to fourth side surfaces; and a second insulating layer covering at least one of the first to fourth corner portions.
A printed circuit board comprising:
A printed circuit board comprising:
A printed circuit board comprising:
Dependencies are inferred from the claim text.