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US 12,550,254 B2Granted
Wiring substrate
AssigneeKioxia Corporation
InventorMotoshi Seto
Life of this patent
Estimating the term…
Abstract
A wiring substrate according to one embodiment includes a plurality of wiring layers and a plurality of insulating layers alternately stacked in a stacking direction. The plurality of wiring layers include a first wiring layer closest to a surface on one side in the stacking direction of the wiring substrate and a second wiring layer second closest to the surface. A distance from the surface to the first wiring layer is larger than a distance from the first wiring layer to the second wiring layer.
Claims14
A wiring substrate comprising:
- a plurality of wiring layers and a plurality of insulating layers alternately stacked in a stacking direction, wherein
- the plurality of wiring layers include:
- a first wiring layer closest to a surface on one side in the stacking direction of the wiring substrate;
- and
- a second wiring layer second closest to the surface on the one side, and
- a distance from the surface on the one side to the first wiring layer in the stacking direction is larger than a distance from the first wiring layer to the second wiring layer in the stacking direction;
- a solder resist disposed on the one side in the stacking direction with respect to the plurality of wiring layers and the plurality of insulating layers;
- and
- an electrically conductive through-member extending in the stacking direction from the one side to the other side in the stacking direction with respect to the plurality of wiring layers, the plurality of insulating layers, and the solder resist, wherein
- the through-member includes a land disposed at an end portion on the one side in the stacking direction, and
- the land is spaced from the solder resist.
8 more elements
A wiring substrate comprising:
- a plurality of wiring layers and a plurality of insulating layers alternately stacked in a stacking direction;
- a plurality of electrically conductive through-members extending in the stacking direction from one side to the other side in the stacking direction with respect to the plurality of wiring layers and the plurality of insulating layers, the plurality of electrically conductive through-members being arranged in a first direction intersecting with the stacking direction and a second direction intersecting with the stacking direction and the first direction;
- and
- a solder resist disposed on the one side in the stacking direction with respect to the plurality of wiring layers and the plurality of insulating layers, wherein
- each of the plurality of through-members includes a land disposed on one end portion of the one side or the other side in the stacking direction,
- a distance between two lands adjacent in the first direction or the second direction is 0.2 mm or more, and
- a plurality of the lands corresponding to the plurality of through-members are spaced from the solder resist.
4 more elements
A wiring substrate comprising:
- a plurality of wiring layers and a plurality of insulating layers alternately stacked in a stacking direction;
- an electrically conductive through-member extending in the stacking direction from one side to the other side in the stacking direction with respect to the plurality of wiring layers and the plurality of insulating layers;
- a connector pin disposed inside the through-member;
- a solder disposed at an end portion on the one side in the stacking direction of the through-member, the solder being electrically conductive with the through-member and the connector pin;
- and
- a solder resist disposed on the one side in the stacking direction with respect to the plurality of wiring layers and the plurality of insulating layers, wherein
- an end portion on the other side in the stacking direction of the solder is disposed between a surface on the one side in the stacking direction of the wiring substrate and a surface on the other side in the stacking direction of the wiring substrate,
- the through-member includes a land disposed at an end portion on the one side in the stacking direction, and
- the land is spaced from the solder resist.
6 more elements
Dependencies are inferred from the claim text.