Printed wiring board manufacturing method and processing system
AssigneeIbiden Co., Ltd.
InventorsKatsuo Kawaguchi, Tsutomu Yamauchi, Takeshi Takagi, Takuya Otsuki, Masanori Sano
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AssigneeIbiden Co., Ltd.
InventorsKatsuo Kawaguchi, Tsutomu Yamauchi, Takeshi Takagi, Takuya Otsuki, Masanori Sano
Estimating the term…
A method for manufacturing a printed wiring board includes preparing an intermediate substrate including an insulating layer, a conductor layer including circuits, and a first resin insulating layer, inputting, to a laser processing machine that forms openings, positions of the openings, generating, based on analysis of the conductor layer, classification of the circuits, inputting, to the machine, shot numbers for forming the openings determined based on the classification, and executing the machine based on the positions and shot numbers such that the openings are formed. The circuits include power supply, ground, and signal circuits, the classification includes stratifying such that the power supply and ground circuits belong to the first category and the signal circuits belong to the second category, and the inputting includes setting the shot number for the openings belonging to the first category is smaller than the shot number for the openings belonging to the second category.
A method for manufacturing a printed wiring board, comprising:
Dependencies are inferred from the claim text.