H05K 3/4644
By building the multilayer layer by layer, i.e. build-up multilayer circuits
Official title: {by building the multilayer layer by layer, i.e. build-up multilayer circuits (making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602)}
H05K3/4644 (By building the multilayer layer by layer, i.e. build-up multilayer circuits) appears on 5,422 US grants and 5,820 published applications in this corpus.
Search patents in H05K- Granted patents
- 5,422
- Published applications
- 5,820
- Assignees
- 1,262
- Inventors
- 9,299
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 3 | 0 |
| 1978 | 0 | 0 |
| 1979 | 4 | 0 |
| 1980 | 6 | 0 |
| 1981 | 7 | 0 |
| 1982 | 12 | 0 |
| 1983 | 13 | 0 |
| 1984 | 16 | 0 |
| 1985 | 17 | 0 |
| 1986 | 17 | 0 |
| 1987 | 40 | 0 |
| 1988 | 45 | 0 |
| 1989 | 40 | 0 |
| 1990 | 54 | 0 |
| 1991 | 44 | 0 |
| 1992 | 77 | 0 |
| 1993 | 66 | 0 |
| 1994 | 60 | 0 |
| 1995 | 74 | 0 |
| 1996 | 58 | 0 |
| 1997 | 57 | 0 |
| 1998 | 84 | 0 |
| 1999 | 108 | 0 |
| 2000 | 90 | 0 |
| 2001 | 127 | 59 |
| 2002 | 108 | 157 |
| 2003 | 134 | 151 |
| 2004 | 139 | 211 |
| 2005 | 103 | 202 |
| 2006 | 114 | 237 |
| 2007 | 136 | 234 |
| 2008 | 120 | 314 |
| 2009 | 129 | 316 |
| 2010 | 203 | 255 |
| 2011 | 194 | 253 |
| 2012 | 229 | 217 |
| 2013 | 195 | 206 |
| 2014 | 160 | 288 |
| 2015 | 188 | 274 |
| 2016 | 241 | 282 |
| 2017 | 221 | 250 |
| 2018 | 227 | 217 |
| 2019 | 234 | 253 |
| 2020 | 223 | 267 |
| 2021 | 221 | 200 |
| 2022 | 191 | 236 |
| 2023 | 162 | 238 |
| 2024 | 177 | 222 |
| 2025 | 147 | 154 |
| 2026 | 101 | 127 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 3/4652Adding a circuit layer by laminating a metal foil or a preformed1,195
- H05K 3/4682Manufacture of core-less build-up multilayer circuits on a temporary carrier or on711
- H05K 3/4673Application methods or materials of intermediate insulating layers not specially adapted to627
- H05K 3/4664Adding a circuit layer by thick film methods564
- H05K 3/4661Adding a circuit layer by direct wet plating451
- H05K 3/4647By applying an insulating layer around previously made via studs432
- H05K 3/465By applying an insulating layer having channels for the next circuit layer259
- H05K 3/467Adding a circuit layer by thin film methods232
All 9 subgroupsShow fewer
Recent patents
- Buried skip vias for improved signal and power integrity6 Oct 2026US 12,757,327 B2NVIDIA Corporation
- Method for integrating a copper-graphene laminate (CGL) in a multilayer PCB fabrication process6 Oct 2026US 12,757,335 B2Bar-Ilan University
- Circuit board and manufacturing method thereof29 Sep 2026US 12,750,957 B2Avary Holding (Shenzhen) Co., Limited.
- Embedded inductor structure and manufacturing method thereof15 Sep 2026US 12,739,976 B2Unimicron Technology Corp.
- Method of producing printed circuit boards and printed circuit boards produced in accordance with the method8 Sep 2026US 12,733,108 B2Gebr. Schmid GmbH & Co.
- Method for manufacturing circuit board and circuit board8 Oct 2026US 2026/0313796 A1Resonac Corporation
- Adhesive film, adhesive film with metal layer, wiring formation member, formation method for wiring layer, and wired member1 Oct 2026US 2026/0297391 A1Resonac Corporation
- Circuit forming method and circuit forming apparatus1 Oct 2026US 2026/0304641 A1Fuji Corporation
- Forming a circuit bearing structure with particle-free metal ink1 Oct 2026US 2026/0304645 A1LCP Medical Technologies, Inc.
- Forming a circuit bearing structure with dielectric ink1 Oct 2026US 2026/0304646 A1LCP Medical Technologies, Inc.
Most cited
By later US patents
- Two-layer capacitive touchpad and method of making same2,193US 6,188,391 B1Synaptics Incorporated · 2001
- Electroless CU deposition on a barrier layer by CU contact displacement for ULSI applications448US 5,891,513 ACornell Research Foundation, Inc. · 1999
- Rear electrode structures for displays432US 6,445,374 B2E Ink Corporation · 2002
- Method for producing coplanar multi-level metal/insulator films on a substrate and for forming patterned conductive lines simultaneously with stud vias406US 4,789,648 AInternational Business Machines Corporation · 1988
- Method for making an electronic module391US 5,745,984 AMartin Marietta Corporation · 1998