H05K 3/4647
By applying an insulating layer around previously made via studs
Official title: {by applying an insulating layer around previously made via studs}
H05K3/4647 (By applying an insulating layer around previously made via studs) appears on 432 US grants and 441 published applications in this corpus.
Search patents in H05K- Granted patents
- 432
- Published applications
- 441
- Assignees
- 178
- Inventors
- 943
- Latest grant
- 2 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 5 | 0 |
| 1989 | 4 | 0 |
| 1990 | 3 | 0 |
| 1991 | 7 | 0 |
| 1992 | 8 | 0 |
| 1993 | 10 | 0 |
| 1994 | 7 | 0 |
| 1995 | 11 | 0 |
| 1996 | 8 | 0 |
| 1997 | 5 | 0 |
| 1998 | 7 | 0 |
| 1999 | 14 | 0 |
| 2000 | 6 | 0 |
| 2001 | 12 | 8 |
| 2002 | 13 | 17 |
| 2003 | 15 | 15 |
| 2004 | 14 | 25 |
| 2005 | 12 | 24 |
| 2006 | 7 | 23 |
| 2007 | 21 | 24 |
| 2008 | 14 | 37 |
| 2009 | 14 | 45 |
| 2010 | 21 | 19 |
| 2011 | 15 | 19 |
| 2012 | 21 | 29 |
| 2013 | 21 | 14 |
| 2014 | 11 | 23 |
| 2015 | 12 | 12 |
| 2016 | 13 | 9 |
| 2017 | 8 | 19 |
| 2018 | 19 | 14 |
| 2019 | 11 | 19 |
| 2020 | 13 | 7 |
| 2021 | 6 | 5 |
| 2022 | 10 | 8 |
| 2023 | 5 | 13 |
| 2024 | 6 | 5 |
| 2025 | 7 | 7 |
| 2026 | 3 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package and method2 Jun 2026US 12,648,452 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method of manufacturing multi-layer circuit board including extreme fine via and multi-layer circuit board manufactured by the same7 Apr 2026US 12,598,707 B2Tse Co., Ltd.
- Stud bumped printed circuit assembly3 Mar 2026US 12,568,576 B2
- Composite layer circuit element23 Sep 2025US 12,424,454 B2Innolux Corporation
- Systems and methods for manufacturing electrical components using electrochemical deposition15 Jul 2025US 12,359,334 B2Fabric8Labs, Inc.
- Circuit board29 Jan 2026US 2026/0032811 A1Murata Manufacturing Co., Ltd.
- Systems and methods for manufacturing electrical components using electrochemical deposition13 Nov 2025US 2025/0347023 A1Fabric8Labs, Inc.
- Stud bumped printed circuit assembly6 Nov 2025US 2025/0344319 A1LCP Medical Technologies, Inc.
- Wiring substrate2 Oct 2025US 2025/0311097 A1Ibiden Co., Ltd.
- Printed circuit board2 Oct 2025US 2025/0311100 A1Samsung Electro-Mechanics Co., Ltd.
Most cited
By later US patents
- Method for producing multilayer printed wiring boards247US 5,258,094 ANEC Corporation · 1993
- Miniature RF and microwave components and methods for fabricating such components233US 7,830,228 B2Microfabrica Inc. · 2010
- Double-sided hybrid high density circuit board and method of making same180US 5,072,075 ADigital Equipment Corporation · 1991
- Manufacturing methods for printed circuit boards142US 6,902,869 B2International Business Machines Corporation · 2005
- Hybrid wiring board, semiconductor apparatus, flexible substrate, and fabrication method of hybrid wiring board121US 6,329,610 B1Kabushiki Kaisha Toshiba · 2001