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US 6,329,610 B1Granted
Hybrid wiring board, semiconductor apparatus, flexible substrate, and fabrication method of hybrid wiring board
AssigneeKabushiki Kaisha Toshiba
InventorsChiaki Takubo, Yoshizumi Sato, Tomitsugu Kojima, Go Takeda
Life of this patent
Estimating the term…
Abstract
A first via land of a wiring layer on a first surface of a first insulation layer that is a rigid layer and a second via land of a wiring layer on a second surface of a second insulation layer that is a flexible layer are electrically and mechanically connected with a conductive pillar pierced through a third insulation layer disposed between the first insulation layer and the second insulation layer. In such a structure, a wiring board that can mount a highly integrated semiconductor device, that is small and thin, and that has high reliability can be accomplished.
Claims37
A hybrid wiring board, comprising:
- a first wiring substrate having a first face and a second face, the first wiring substrate having first wiring layers formed onto the first and second faces of the first wiring substrate, the first wiring layers being connected electrically with each other through the first wiring substrate;
- a second wiring substrate having a first face and a second face, the second wiring substrate having second wiring layers formed onto the first and second faces of the second wiring substrate, the second wiring layers being connected electrically with each other through the second wiring substrate;
- an insulating resin layer interposed between and contacting the first face of the first wiring substrate and the second face of the second wiring substrate, wherein the first wiring layer on the first face of the first wiring substrate and the second wiring layer on the second face of the second wiring substrate are intruded into the insulating resin layer;
- and
- a conductive filled pillar pierced through the insulating resin layer so as to connect the first wiring layer on the first face of the first wiring substrate and the second wiring layer on the second face of the second wiring substrate.
2 more elements
A hybrid wiring board, comprising:
- a first insulating layer having a first face and a second face, the first insulating layer having a first flexibility;
- first wiring layers formed onto the first and second faces of the first insulating layer, the first wiring layer on the first face of the first insulating layer having a first via land and being connected electrically with the first wiring layer on the second face of the first insulating layer through the first insulating layer;
- a second insulating layer having a first face and second face, the second insulating layer having a second flexibility which is larger than the first flexibility;
- second wiring layers formed onto the first and second faces of the second insulating layer, the second wiring layer on the second face of the second insulating layer having a second via land and being connected electrically with the second wiring layer of the second insulating layer through the second insulating layer;
- a third insulating layer interposed between the first face of the first insulating layer and the second face of the second insulating layer, the third insulating layer having a third flexibility which is smaller than the second flexibility;
- and
- a conductive pillar pierced through the third insulating layer so as to connect the first and second via lands.
4 more elements
A hybrid wiring board comprising:
- a first board which has a flexibility, the first board having a first face and a second face, the first face having a first region and a second region;
- first wiring layers formed on the first and second faces of the first board, the first wiring layers being connected electrically with each other through the first board, the first wiring layer on the first face having a first via land;
- an insulating resin layer formed on the first region of the first board, the insulating resin layer having a first face and a second face, the first face is opposed to the first region of the first board, the insulating resin layer being intruded by the first via land, the insulating resin layer being more rigid than the first board;
- a second wiring layer having a second via land formed on the second face of the insulating resin layer, the second via land being opposed to the first via land;
- and
- a conductive filled pillar pierced through the insulating resin layer so as to connect the first wiring layer on the first face of the first board and the second wiring layer.
3 more elements
A semiconductor device, comprising:
- a first wiring substrate having a first face and a second face, the first wiring substrate having first wiring layers formed on the first and second faces, the first wiring layers being connected electrically with each other through the first wiring substrate, the first wiring layer formed on the first face having a first via land, the first wiring substrate having a rigidity;
- a second wiring substrate having a first face and a second face, the second wiring substrate having second wiring layers formed on the first and second faces, the second wiring layers being connected electrically with each other through the second wiring substrate, the second wiring layer formed on the second face of the second wiring substrate having a second via land, the second wiring substrate being more flexible than the first wiring substrate;
- a semiconductor chip mounted on the first face of the second wiring substrate;
- an insulating resin layer interposed between the first face of the first wiring substrate and the second face of the second wiring substrate;
- and
- at least a conductive pillar pierced through the insulating resin layer so as to connect the first via land and the second via land.
3 more elements
A flexible wiring substrate, comprising:
- an insulating resin film having a first face and a second face, the insulating resin film having a flexibility;
- a first wiring layer formed on the first face of the insulating resin film;
- and
- a second wiring layer formed on the second face of the insulating resin film;
- wherein a surface free energy of the first face of the insulating resin film is smaller than a surface free energy of the second face of the insulating resin film.
2 more elements
A hybrid wiring board, comprising:
- a first wiring substrate having a first face and a second face, the first wiring substrate having a first wiring layer formed onto the first face;
- a second wiring substrate having a first face and a second face, the second wiring substrate having a second wiring layer formed onto the second face;
- an insulating resin layer interposed between and contacting the first face of the first wiring substrate and the second face of the second wiring substrate, wherein the first wiring layer and the second wiring layer are intruded into the insulating resin layer;
- and
- a conductive filled pillar having a convex side surface, said pillar pierced through the insulating resin layer so as to connect the first wiring layer and the second wiring layer.
2 more elements
A hybrid wiring board, comprising:
- a first insulating layer having a first face and a second face, the first insulating layer having a first flexibility;
- a first wiring layer formed onto the first face of the first insulating layer, the first wiring layer having a first via land;
- a second insulating layer having a first face and second face, the second insulating layer having a second flexibility which is larger than the first flexibility;
- a second wiring layer formed onto the second face of the second insulating layer, the second wiring layer having a second via land;
- a third insulating layer interposed between the first face of the first insulating layer and the second face of the second insulating layer, the third insulating layer having a third flexibility which is smaller than the second flexibility;
- and
- a conductive pillar having a convex side surface, said pillar pierced through the third insulating layer so as to connect the first and second via lands.
4 more elements
A hybrid wiring board comprising:
- a first board which has a flexibility, the first board having a first face and a second face, the first face having a first region and a second region;
- a first wiring layer formed on the first face of the first board, the first wiring layer having a first via land;
- an insulating resin layer formed on the first region of the first board, the insulating resin layer having a first face and a second face, the first face is opposed to the first region of the first board, the insulating resin layer being intruded by the first via land, the insulating resin layer being more rigid than the first board;
- a second wiring layer having a second via land formed on the second face of the insulating resin layer, the second via land being opposed to the first via land;
- and
- a conductive filled pillar having a convex side surface, said pillar pierced through the insulating resin layer so as to connect the first wiring layer and the second wiring layer.
3 more elements
A semiconductor device, comprising:
- a first wiring substrate having a first face and a second face, the first wiring substrate having a first wiring layer which has a first via land formed on the first face of the first wiring substrate, the first wiring substrate having a rigidity;
- a second wiring substrate having a first face and a second face, the second wiring substrate having a second wiring layer which has a second via land formed on the second face of the second wiring substrate, the second wiring substrate being more flexible than the first wiring substrate;
- a semiconductor chip mounted on the first face of the second wiring substrate;
- an insulating resin layer interposed between the first face of the first wiring substrate and the second face of the second wiring substrate;
- and
- at least a conductive pillar having a convex side surface, said pillar pierced through the insulating resin layer so as to connect the first via land and the second via land.
3 more elements
Dependencies are inferred from the claim text.