Systems and methods for manufacturing electrical components using electrochemical deposition

A system for making an electrical component, the system comprising:

• a build plate, comprising an intralayer electrical-connection feature;
• a deposition anode array, comprising a plurality of deposition anodes;
• an electrodeposition cell, configured to hold an electrolyte solution;
• a mounting system, configured to position the intralayer electrical-connection feature and the plurality of deposition anodes in direct contact with the electrolyte solution, such that a gap is established between the intralayer electrical-connection feature and the plurality of deposition anodes, when the electrolyte solution is held in the electrodeposition cell;
• a power source, configured to create a voltage potential on the intralayer electrical-connection feature;
• a positioning system, configured to control a distance between the intralayer electrical-connection feature and the plurality of deposition anodes;
• a controller, configured to control a current field across at least some deposition anodes of the plurality of deposition anodes, when the electrodeposition cell holds the electrolyte solution, and when the intralayer electrical-connection feature and the plurality of deposition anodes are positioned in direct contact with the electrolyte solution, to selectively deposit electrically-conductive material onto the intralayer electrical-connection feature to form an interlayer electrical-connection feature of the electrical component;
• a dielectric application station comprising a stopping plate and a dielectric source, wherein:
• the controller is operable to move the build plate relative to the stopping plate so that a gap, in which the intralayer electrical-connection feature and the interlayer electrical-connection feature are located, is defined between the stopping plate and the build plate, wherein the controller controls a size of the gap such that a portion of the interlayer electrical-connection feature contacts the stopping plate;
• and
• when the gap is defined between the stopping plate and the build plate, the controller is configured to control operation of the dielectric source so that a dielectric material supplied by the dielectric source flows into and fills at least a portion of the gap from the stopping plate to the build plate so that the dielectric material contacts and electrically insulates the intralayer electrical-connection feature, contacts and at least partially electrically insulates the interlayer electrical-connection feature, and is secured to the build plate;
• a plating station configured to deposit a seed layer, made of an electrically conductive material, onto the dielectric material and the interlayer electrical-connection feature after the dielectric application station couples the dielectric material to the build plate, wherein the power source is further configured to create a voltage potential on the seed layer and, after the seed layer is formed, the controller is further configured to control a second current field across at least some deposition anodes of the plurality of deposition anodes, when the electrodeposition cell holds the electrolyte solution and when the seed layer and the plurality of deposition anodes are positioned in direct contact with the electrolyte solution, to selectively deposit electrically-conductive material onto the seed layer to form at least one second intralayer electrical-connection feature of the electrical component;
• and
• an etching station configured to remove one or more portions of the seed layer, onto which the electrically-conductive material is not deposited.