US 2026/0032811 A1Published application

Circuit board

AssigneeMurata Manufacturing Co., Ltd.

InventorTomohiro FURUMURA

Life of this patent

Estimating the term…

Loading patent…

Abstract

A circuit board includes an insulating layer, first and second interlayer connection conductors penetrating an insulating layer in a thickness direction, first and second conductor layers respectively on first and second main surfaces of the insulating layer and connected to the first interlayer connection conductor, and third and fourth conductor layers respectively on the first and second main surfaces and connected to the second interlayer connection conductor. The first and second interlayer connection conductors respectively include first and second portions and third and fourth portions. When a height of the first portion is A1, a height of the second portion is B1, a height of the third portion is A2, a height of the fourth portion is B2, a height of the first interlayer connection conductor is T1, and a height of the second interlayer connection conductor is T2, relationships of T1<T2 and B1/A1>B2/A2 are satisfied.

Claims19

Dependent claims

A circuit board comprising:

an insulating layer including a first main surface and a second main surface facing each other in a thickness direction;
a first interlayer connection conductor and a second interlayer connection conductor penetrating a same insulating layer or different insulating layers in the thickness direction;
a first conductor layer on the first main surface of the insulating layer and connected to the first interlayer connection conductor;
a second conductor layer on the second main surface of the insulating layer and connected to the first interlayer connection conductor;
a third conductor layer on the first main surface of the insulating layer and connected to the second interlayer connection conductor;
and
a fourth conductor layer on the second main surface of the insulating layer and connected to the second interlayer connection conductor;
wherein
the first interlayer connection conductor includes a first portion and a second portion with lower conductivity than the first portion in the thickness direction;
one end portion of the first portion is bonded to the first conductor layer, and an other end portion of the first portion is bonded to one end portion of the second portion;
an other end portion of the second portion is bonded to the second conductor layer;
the second interlayer connection conductor includes a third portion and a fourth portion with lower conductivity than the third portion in the thickness direction;
one end portion of the third portion is bonded to the third conductor layer, and an other end portion of the third portion is bonded to one end portion of the fourth portion;
an other end portion of the fourth portion is bonded to the fourth conductor layer;
and
when a height of the first portion is A1, a height of the second portion is B1, a height of the third portion is A2, a height of the fourth portion is B2, a height of the first interlayer connection conductor is T1, and a height of the second interlayer connection conductor is T2, relationships of T1<T2 and B1/A1>B2/A2 are satisfied.

13 more elements

A circuit board comprising:

an insulating layer including a first main surface and a second main surface facing each other in a thickness direction;
a first interlayer connection conductor and a third interlayer connection conductor penetrating a same insulating layer or different insulating layers in the thickness direction;
a first conductor layer on the first main surface of the insulating layer and connected to the first interlayer connection conductor;
a second conductor layer on the second main surface of the insulating layer and connected to the first interlayer connection conductor;
a fifth conductor layer on the first main surface of the insulating layer and connected to the third interlayer connection conductor;
and
a sixth conductor layer on the second main surface of the insulating layer and connected to the fourth interlayer connection conductor;
wherein
the first interlayer connection conductor includes a first portion and a second portion with lower conductivity than the first portion in the thickness direction;
one end portion of the first portion is bonded to the first conductor layer, and an other end portion of the first portion is bonded to one end portion of the second portion;
an other end portion of the second portion is bonded to the second conductor layer;
the third interlayer connection conductor includes a fifth portion, a sixth portion with lower conductivity than the fifth portion, and a seventh portion with higher conductivity than the sixth portion in the thickness direction;
one end portion of the fifth portion is bonded to the fifth conductor layer, and an other end portion of the fifth portion is bonded to one end portion of the sixth portion;
an other end portion of the sixth portion is bonded to one end portion of the seventh portion;
an other end portion of the seventh portion is bonded to the sixth conductor layer;
and
when a height of the first portion is A1, a height of the second portion is B1, a height of the fifth portion is A3, a height of the sixth portion is B3, a height of the seventh portion is C3, a height of the first interlayer connection conductor is T1, and a height of the third interlayer connection conductor is T3, relationships of T1<T3 and B1/A1>B3/(A3+C3) are satisfied.

14 more elements

Dependencies are inferred from the claim text.

Facts

Application: 19/343,266Filed 29 Sep 2025
Priority: JP 2023-06929720 Apr 2023
Published: 29 Jan 2026
Term ends: Not estimatedThe source records don’t support an estimate.

Classification15 codes

H05K 1/0298
Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295: multilayer circuits
H05K 3/4647
By building the multilayer layer by layer, i.e. build-up multilayer circuits: by applying an insulating layer around previously made via studs
H05K 1/0265
High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one…:…
H05K 1/115
Printed elements for providing electric connections to or between printed circuits: via connections; Lands around holes or via connections