H05K 3/4682
Manufacture of core-less build-up multilayer circuits on a temporary carrier or on
Official title: {Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil}
H05K3/4682 (Manufacture of core-less build-up multilayer circuits on a temporary carrier or on) appears on 711 US grants and 926 published applications in this corpus.
Search patents in H05K- Granted patents
- 711
- Published applications
- 926
- Assignees
- 191
- Inventors
- 1,323
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 3 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 4 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 3 |
| 2002 | 4 | 3 |
| 2003 | 3 | 8 |
| 2004 | 4 | 13 |
| 2005 | 5 | 10 |
| 2006 | 7 | 27 |
| 2007 | 17 | 25 |
| 2008 | 12 | 24 |
| 2009 | 14 | 26 |
| 2010 | 15 | 51 |
| 2011 | 15 | 48 |
| 2012 | 37 | 42 |
| 2013 | 41 | 43 |
| 2014 | 36 | 58 |
| 2015 | 49 | 63 |
| 2016 | 48 | 73 |
| 2017 | 50 | 60 |
| 2018 | 53 | 55 |
| 2019 | 47 | 41 |
| 2020 | 49 | 45 |
| 2021 | 42 | 40 |
| 2022 | 32 | 39 |
| 2023 | 28 | 36 |
| 2024 | 28 | 46 |
| 2025 | 35 | 28 |
| 2026 | 15 | 19 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board and manufacturing method thereof8 Sep 2026US 12,733,112 B2Samsung Electro-Mechanics Co., Ltd.
- Method for producing wiring board25 Aug 2026US 12,721,211 B2Mitsui Kinzoku Company, Limited
- Circuit board11 Aug 2026US 12,707,563 B2LG Innotek Co., Ltd.
- Wiring substrate4 Aug 2026US 12,702,023 B2Ibiden Co., Ltd.
- Wiring board structure21 Jul 2026US 12,690,141 B2Unimicron Technology Corp.
- Semiconductor substrate including first and second conductive posts and a plurality of first and second circuit layer pads10 Sep 2026US 2026/0271754 A1Advanced Semiconductor Engineering, Inc.
- Method for producing wiring board27 Aug 2026US 2026/0255472 A1Mitsui Mining & Smelting Co., Ltd.
- Printed circuit board13 Aug 2026US 2026/0239529 A1Samsung Electro-Mechanics Co., Ltd.
- Printed circuit board, manufacturing method thereof, and electronic component package including the same13 Aug 2026US 2026/0239531 A1Samsung Electro-Mechanics Co., Ltd.
- Wiring substrate and method of manufacturing the wiring substrate30 Jul 2026US 2026/0223290 A1Shinko Electric Industries Co., Ltd.
Most cited
By later US patents
- High-density, multi-level interconnects, flex circuits, and tape for tab285US 5,106,461 AMassachusetts Institute of Technology · 1992
- Flip chip type semiconductor device and method for manufacturing the same132US 6,406,942 B2NEC Corporation · 2002
- Method of making multilayered substrate for semiconductor device101US 6,418,615 B1Shinko Electronics Industries, Co., Ltd. · 2002
- Methods of forming two-sided HDMI interconnect structures88US 5,691,245 AHE Holdings, Inc. · 1997
- Attachment method for assembly of high density multiple interconnect structures88US 5,998,291 ARaytheon Company · 1999