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US 6,406,942 B2Granted
Flip chip type semiconductor device and method for manufacturing the same
AssigneeNEC Corporation
InventorHirokazu Honda
Life of this patent
Estimating the term…
Abstract
A multilayer wiring structure is formed on a flat metal plate and then an entire surface of the metal plate is etched away to thereby leave only a multilayer wiring layer. An insulating substrate having through hole sections is bonded to the multilayer wiring layer, a conductive bonding agent is embedded into the through hole section, a semiconductor chip is mounted and a solder ball is coupled.
Claims8
A flip chip type semiconductor device manufacturing method, comprising the steps of:
- forming a multilayer wiring structure on a first substrate consisting of a flat metal plate;
- etching away said first substrate to form a second substrate consisting of a multilayer wiring layer;
- coupling a third substrate to the second substrate consisting of said multilayer wiring layer to obtain a multilayer wiring substrate;
- and
- mounting a semiconductor chip on said second substrate.
2 more elements
Dependencies are inferred from the claim text.