Wiring substrate and method of manufacturing the wiring substrate
AssigneeShinko Electric Industries Co., Ltd.
InventorsNaotaka Noguchi, Naoyuki Kanda
Life of this patent
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Abstract
A wiring substrate includes a wiring layer and an insulating layer. The wiring layer includes a conductor pattern, and a plurality of wiring patterns that are formed side by side in a predetermined area sandwiched between a pair of conductor patterns and that have a smaller occupied area than the conductor pattern. The insulating layer is laminated on the wiring layer. Among the plurality of wiring patterns, the heights of the wiring patterns that are arranged at a central portion of the predetermined area are lower than the heights of the wiring patterns that are arranged at both end portions of the predetermined area.
Claims4
A wiring substrate comprising:a wiring layer that includes a conductor pattern, anda plurality of wiring patterns that are formed side by side in a predetermined area sandwiched between a pair of the conductor patterns and that have a smaller occupied area than the conductor pattern;
- andan insulating layer that is laminated on the wiring layer, wherein,among the plurality of wiring patterns, heights of the wiring patterns that are arranged at a central portion of the predetermined area are lower than heights of the wiring patterns that are arranged at both end portions of the predetermined area.
Dependencies are inferred from the claim text.