H05K 3/4679
Aligning added circuit layers or via connections relative to previous circuit layers
Official title: {Aligning added circuit layers or via connections relative to previous circuit layers}
H05K3/4679 (Aligning added circuit layers or via connections relative to previous circuit layers) appears on 149 US grants and 195 published applications in this corpus.
Search patents in H05K- Granted patents
- 149
- Published applications
- 195
- Assignees
- 106
- Inventors
- 329
- Latest grant
- 10 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 2 |
| 2002 | 2 | 2 |
| 2003 | 5 | 6 |
| 2004 | 1 | 5 |
| 2005 | 1 | 10 |
| 2006 | 7 | 5 |
| 2007 | 3 | 1 |
| 2008 | 4 | 9 |
| 2009 | 3 | 10 |
| 2010 | 7 | 3 |
| 2011 | 3 | 13 |
| 2012 | 6 | 4 |
| 2013 | 6 | 5 |
| 2014 | 5 | 6 |
| 2015 | 9 | 12 |
| 2016 | 8 | 11 |
| 2017 | 10 | 10 |
| 2018 | 10 | 12 |
| 2019 | 13 | 16 |
| 2020 | 8 | 7 |
| 2021 | 3 | 6 |
| 2022 | 5 | 12 |
| 2023 | 8 | 6 |
| 2024 | 6 | 12 |
| 2025 | 5 | 7 |
| 2026 | 3 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Plurality of build-up layers in a circuit board structure7 Oct 2025US 12,439,529 B2Unimicron Technology Corp.
- Layer-to-layer registration measurement mark24 Jun 2025US 12,342,455 B2International Business Machines Corporation
- Circuit forming method and circuit forming apparatus1 Oct 2026US 2026/0304641 A1Fuji Corporation
- Glass Barrier Layer Product, and Manufacture Method30 Jul 2026US 2026/0223288 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Wiring substrate7 May 2026US 2026/0129762 A1Ibiden Co., Ltd.
- Method for manufacturing multilayer substrate27 Nov 2025US 2025/0365869 A1Fict Limited
- Stud bumped printed circuit assembly6 Nov 2025US 2025/0344319 A1LCP Medical Technologies, Inc.
Most cited
By later US patents
- Multilayer circuit board manufacturing278US 4,642,160 AInterconnect Technology Inc. · 1987
- Blind via laser drilling system115US 6,211,485 B12001
- Blind via laser drilling system91US 6,631,558 B2Laservia Corporation · 2003
- Conveyorized blind microvia laser drilling system37US 7,062,845 B2Laservia Corporation · 2006
- Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board31US 7,456,372 B2Ibiden Co., Ltd. · 2008