Plurality of build-up layers in a circuit board structure
AssigneeUnimicron Technology Corp.
InventorsShao-Chien Lee, Ching-Sheng Chen, Heng-Ming Nien, Pei-Wei Wang
Life of this patent
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Abstract
A manufacturing method for circuit board structure includes steps of providing a carrier, forming a first build-up layer including a plurality of first circuits, forming a second build-up layer including a plurality of second circuits on a side of the first build-up layer located away from the carrier, attaching a side of the second build-up layer located away from the first build-up layer to a core layer, and removing the carrier from the first build-up layer, where the first circuits are finer than the second circuits.
Claims11
A manufacturing method for circuit board structure, comprising:
- providing a carrier;
- forming a first build-up layer on the carrier, wherein the first build-up layer comprises a plurality of first circuits;
- forming a second build-up layer on a side of the first build-up layer located away from the carrier, wherein the second build-up layer comprises a plurality of second circuits, and the plurality of first circuits are finer than the plurality of second circuits;
- attaching a side of the second build-up layer located away from the first build-up layer to a core layer;
- removing the carrier from the first build-up layer and wherein the at least one first conductive via and the at least one second conductive via are tapered towards a direction away from the core layer.
A circuit board structure, comprising:
- a first build-up layer comprising a plurality of first circuits and at least one first conductive via structurally connected to at least part of the plurality of first circuits;
- a second build-up layer disposed on the first build-up layer and comprising a plurality of second circuits and at least one second conductive via structurally connected to at least part of the plurality of second circuits, wherein the plurality of first circuits are finer than the plurality of second circuits;
- and
- a core layer disposed on a side of the second build-up layer located away from the first build-up layer;
- wherein the at least one first conductive via and the at least one second conductive via are tapered towards a direction away from the core layer.
Dependencies are inferred from the claim text.