Conveyorized blind microvia laser drilling system

A laser drilling system for drilling blind vias in printed circuit board panels, multichip modules and chipscale packages with top and bottom surfaces which include multiple dielectric polymer and metal layers, the system comprising:

• a first laser module comprising:
• a laser with the capability to form at least one via per pulse through one or more polymer layers wherein the vias are circular or non-circular in shape,
• an articulated arm adapted to move at a speed of about 200 inches per second and at an acceleration of about 5 g's or more, and
• a beam delivery unit attached to the articulated arm wherein,
• the beam of the laser travels inside the articulated arm to the beam delivery unit, and
• the beam delivery unit focuses the laser beam for use in drilling the top surface;
• a conveyor adapted to move panels wherein,
• the conveyor moves to deliver the panel to the first laser module, the conveyor stops moving so the first laser module can drill vias in the top surface of the panel, and
• the conveyor moves again to deposit the drilled panel and deliver a new panel.