Wiring substrate

A method for manufacturing a wiring substrate, comprising:

• forming a metal layer on a support plate;
• forming a first alignment mark on the metal layer;
• laminating a second resin insulating layer on the metal layer such that the second resin insulating layer covers the first alignment mark;
• forming a first conductor layer on the second resin insulating layer;
• forming an uppermost first resin insulating layer on the second resin insulating layer such that the uppermost first resin insulating layer covers the first conductor layer;
• forming a second conductor layer on the uppermost first resin insulating layer;
• forming a lowermost first resin insulating layer on the uppermost first resin insulating layer such that the lowermost first resin insulating layer covers the conductor layer;
• forming a cavity in the uppermost first resin insulating layer and the lowermost first resin insulating layer such that the cavity penetrates through the uppermost first resin insulating layer and the lowermost first resin insulating layer;
• accommodating a component in the cavity formed in the uppermost first resin insulating layer and the lowermost first resin insulating layer such that the component is positioned relative to the first alignment mark;
• forming a third resin insulating layer on the lowermost first resin insulating layer;
• forming a third conductor layer on the third resin insulating layer;
• removing the support plate and the metal layer from the second resin insulating layer;
• and
• forming an opening in the second resin insulating layer at a position relative to the first alignment mark such that the opening penetrates through the second resin insulating layer and exposes an electrode of the component.