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US 7,456,372 B2Granted
Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board
AssigneeIbiden Co., Ltd.
InventorYasuji Hiramatsu
Life of this patent
Estimating the term…
Abstract
There is provided a laser processing apparatus, a multilayer printed wiring board manufacturing apparatus, and a manufacturing method to form via holes of ultra-fine diameter. The laser beam from the CO2 laser oscillator (60) is converted to the shortened wavelength beam by a tellurium crystal (94) to control diffraction of the laser beam. Simultaneously, when the laser beam is condensed, a limit value of the condensation limit is reduced. Thereby, the spot diameter of laser beam is reduced and a hole for via hole is bored on the interlayer insulation resin on a substrate (10). Therefore, even when the laser beam output is raised to form a deeper hole, the hole diameter is not widened and thereby a hole for a small diameter via hole can be formed.
Claims19
A multilayer printed wiring board manufacturing method comprising:
- providing a manufacturing apparatus comprising a CO2 laser source configured to emit a laser pulse beam of 1-50 μsec, a harmonic wave generating apparatus configured to convert the laser pulse beam to a shortened wavelength beam of a second harmonic wave, a scanning head configured to deflect the shortened wavelength beam in X-Y directions, an X-Y table configured to support a multilayer printed wiring board having at least one target mark, and a camera configured to measure a position of the at least one target mark of the multilayer printed wiring board;
- measuring with the camera the position of the at least one target mark of the multilayer printed wiring board having an interlayer resin insulator placed on the X-Y table;
- generating drive data for driving at least one of the scanning head and the X-Y table based on the position of the at least one target mark and processing data of the multilayer printed wiring board;
- controlling at least one of the X-Y table and the scanning head based on the drive data;
- and
- applying the shortened wavelength beam of the second harmonic wave transmitted from the harmonic wave generating apparatus to the multilayer printed wiring board to form a hole in the interlayer resin layer of the multilayer printed wiring board.
3 more elements
A laser processing apparatus comprising:
- a CO2 laser source configured to emit a laser pulse beam of 1-50 μsec;
- harmonic wave generating means for converting the laser pulse beam to a shortened wavelength laser beam of a second harmonic wave;
- a scanning head configured to deflect the shortened wavelength laser beam in X-Y directions;
- and
- an X-Y table configured to support a work piece to be processed.
2 more elements
A laser processing apparatus comprising:
- a processing laser source configured to emit a laser pulse beam of 1-50 μsec;
- harmonic wave generating means for converting the laser pulse beam emitted from said processing laser source to a shortened wavelength beam of a second harmonic wave;
- a scanning head configured to deflect the shortened wavelength beam in X-Y directions;
- and
- an X-Y table configured to move a work piece to be processed,
- wherein said processing laser source emits the laser pulse beam having a wavelength of 720 nm or less, or 6000 nm or more.
3 more elements
A multilayer printed wiring board manufacturing method comprising:
- forming at least one positioning mark and an interlayer insulating agent layer over the at least one positioning mark on a multilayer printed wiring board;
- providing a multilayer printed wiring board manufacturing apparatus including a processing CO2 laser source configured to emit a laser pulse beam of 1-50 μsec, a scanning head configured to deflect the laser pulse beam in X-Y directions, a camera configured to measure a position of the at least one positioning mark of the multilayer printed wiring board, an X-Y table configured to support the multilayer printed wiring board, and a control apparatus having an input section to which processing data of the multilayer printed wiring board is input, an arithmetic operating section configured to correct the processing data based on the position of the at least one positioning mark and generate drive data for driving at least one of the scanning head and the X-Y table, and a memory section configured to store the processing data and the drive data;
- placing the multilayer printed wiring board having said at least one positioning mark on the X-Y table;
- inputting the processing data to the manufacturing apparatus;
- measuring the position of the at least one positioning mark through the interlayer insulating agent layer with the camera;
- correcting the processing data based on the position of the at least one positioning mark;
- generating the drive data for driving at least one of the scanning head and the X-Y table in the arithmetic operating section;
- controlling at least one of the X-Y table and the scanning head based on the drive data;
- and
- applying the laser pulse beam to the multilayer printed wiring board to form a hole in the interlayer insulating agent layer in the multilayer printed wiring board,
- wherein the forming of the at least one positioning mark comprises forming a plurality of positioning marks including first positioning marks and second positioning marks such that the first positioning marks are formed over the second positioning marks and displaced from the second positioning marks in a lateral direction, respectively.
8 more elements
A multilayer printed wiring board manufacturing apparatus comprising:
- a CO2 laser source configured to emit a laser pulse beam of 1-50 μsec;
- a scanning head configured to deflect the laser pulse beam in X-Y directions,
- an X-Y table configured to move the multilayer printed wiring board disposed thereon;
- and
- harmonic wave generating means for converting the laser pulse beam emitted from said CO2 laser source to a pulse beam of a second harmonic wave.
2 more elements
A multilayer printed wiring board manufacturing apparatus comprising:
- a processing laser source configured to emit a laser pulse beam of 1-50 μsec;
- harmonic wave generating means for converting the laser pulse beam emitted from said processing laser source to a shortened wavelength beam of a second harmonic wave;
- a scanning head configured to deflect the shortened wavelength beam in X-Y directions;
- and
- an X-Y table configured to move the multilayer printed wiring board disposed thereon,
- wherein said processing laser source emits the laser pulse beam having a wavelength of 720 nm or less, or 6000 nm or more.
3 more elements
A multilayer printed wiring board manufacturing apparatus comprising:
- a CO2 laser source configured to emit a laser pulse beam of 1-50 μsec;
- harmonic wave generating means for converting the laser pulse beam emitted from said CO2 laser source to a shortened wavelength laser beam of a second harmonic wave;
- a scanning head configured to deflect the shortened wavelength laser beam in X-Y directions;
- an X-Y table configured to support a multilayer printed wiring board having at least one positioning mark;
- a camera configured to measure a position of the at least one positioning mark of the multilayer printed wiring board;
- and
- a control apparatus having an input section to which processing data of the multilayer printed wiring board is input, an arithmetic operating section configured to generate drive data for driving at least one of the scanning head and the X-Y table based on the position of the at least one positioning mark and the processing data and controlling at least one of the X-Y table and the scanning head to apply the shortened wavelength laser beam to the multilayer printed wiring board to form a hole in an interlayer resin layer in the multilayer printed wiring board, and a memory section configured to store the processing data and the drive data.
4 more elements
Dependencies are inferred from the claim text.