H05K 3/4664
Adding a circuit layer by thick film methods
Official title: {Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders (H05K3/4647 takes precedence)}
H05K3/4664 (Adding a circuit layer by thick film methods) appears on 564 US grants and 545 published applications in this corpus.
Search patents in H05K- Granted patents
- 564
- Published applications
- 545
- Assignees
- 307
- Inventors
- 1,183
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 2 | 0 |
| 1982 | 4 | 0 |
| 1983 | 3 | 0 |
| 1984 | 6 | 0 |
| 1985 | 4 | 0 |
| 1986 | 6 | 0 |
| 1987 | 6 | 0 |
| 1988 | 14 | 0 |
| 1989 | 13 | 0 |
| 1990 | 13 | 0 |
| 1991 | 8 | 0 |
| 1992 | 11 | 0 |
| 1993 | 7 | 0 |
| 1994 | 14 | 0 |
| 1995 | 6 | 0 |
| 1996 | 4 | 0 |
| 1997 | 6 | 0 |
| 1998 | 10 | 0 |
| 1999 | 6 | 0 |
| 2000 | 6 | 0 |
| 2001 | 14 | 7 |
| 2002 | 14 | 19 |
| 2003 | 14 | 18 |
| 2004 | 15 | 37 |
| 2005 | 15 | 25 |
| 2006 | 14 | 38 |
| 2007 | 23 | 28 |
| 2008 | 11 | 42 |
| 2009 | 17 | 27 |
| 2010 | 29 | 29 |
| 2011 | 23 | 19 |
| 2012 | 21 | 15 |
| 2013 | 14 | 10 |
| 2014 | 11 | 8 |
| 2015 | 10 | 29 |
| 2016 | 14 | 20 |
| 2017 | 14 | 12 |
| 2018 | 11 | 23 |
| 2019 | 21 | 30 |
| 2020 | 18 | 20 |
| 2021 | 23 | 17 |
| 2022 | 13 | 15 |
| 2023 | 12 | 22 |
| 2024 | 21 | 17 |
| 2025 | 10 | 14 |
| 2026 | 5 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Printer device with automatic printing apparatus for flexible circuit applications4 Aug 2026US 12,701,663 B2Hacettepe Universitesi Rektorluk
- Ultra thin dielectric printed circuit boards with thin laminates and method of manufacturing thereof14 Jul 2026US 12,684,704 B2Sanmina Corporation
- Wiring board, light emitting device, and method for manufacturing thereof7 Apr 2026US 12,598,705 B2Nichia Corporation
- Production method and production device for three-dimensionally fabricated object3 Mar 2026US 12,565,006 B2Fuji Corporation
- Molding method3 Feb 2026US 12,539,662 B2Fuji Corporation
- Circuit forming method and circuit forming apparatus1 Oct 2026US 2026/0304641 A1Fuji Corporation
- Method for producing printed wiring board, photosensitive resin composition, photosensitive resin film, printed wiring board, and semiconductor package2 Jul 2026US 2026/0190248 A1Resonac Corporation
- Additively manufactured electronics packaging with integrated leak detection circuit16 Apr 2026US 2026/0107391 A1Raytheon Company
- Fully 3D Printed mm-Wave Board Embedded Designs with High Integration Levels19 Mar 2026US 2026/0082489 A1Northrop Grumman Systems Corporation
- 3d printed bridges for printed interconnects4 Dec 2025US 2025/0372904 A1
Most cited
By later US patents
- Two-layer capacitive touchpad and method of making same2,193US 6,188,391 B1Synaptics Incorporated · 2001
- Rear electrode structures for displays432US 6,445,374 B2E Ink Corporation · 2002
- Rear electrode structures for displays341US 6,232,950 B1E Ink Corporation · 2001
- Method and apparatus for the computer-controlled manufacture of three-dimensional objects from computer data256US 5,594,652 ATexas Instruments Incorporated · 1997
- Rear electrode structures for displays242US 6,842,167 B2E Ink Corporation · 2005