Additively manufactured electronics packaging with integrated leak detection circuit

A system for detecting degradation of a hermetic seal in an additively manufactured electronics packaging assembly, the system comprising:

• leak detection circuitry configured to:
• receive an additively manufactured electronics packaging assembly comprising an additively printed electronics housing that seals one or more electronic components and one or more additively printed electrical circuits in a component cavity of the additively printed electronics housing;
• and
• measure an electrical characteristic of the one or more additively printed electrical circuits;
• and
• processing circuitry configured to:
• determine an environmental parameter based on the electrical characteristic, the environmental parameter representative of an environment interior to the additively printed electronics housing;
• compare the environmental parameter to one or more criterion;
• and
• based on the comparison, determine that the additively manufactured electronics packaging assembly remains sealed.

A method of forming an additively manufactured electronics packaging assembly, the method comprising:

• forming a build substrate including:
• depositing a first layer of a material on a build plate;
• additively printing a stack of layers on the first layer;
• wherein the stack of layers includes one or more subsequent layers,
• each subsequent layer including a layer interface, the layer interface configured to be intermingled with a layer interface of a subsequent layer of the one or more subsequent layers;
• and
• while additively printing the stack of layers, additively printing one or more electrical interconnects within the stack of layers, each of the one or more the electrical interconnects including a first end portion and a second end portion;
• additively printing an electronics housing along the build substrate and continuously with the build substrate, wherein additively printing the electronics housing comprises:
• depositing one or more wall layers on the build substrate to form a printed wall extending around a component cavity;
• and
• additively printing one or more electrical circuits within the component cavity, the one or more electrical circuits electrically connected to the electrical interconnects, wherein at least one component in the one or more electrical circuits is responsive to a change in an environment interior to the electronics housing;
• and
• sealing the electronics housing with a housing lid by coupling the housing lid with one or more printed walls.