Fully 3D Printed mm-Wave Board Embedded Designs with High Integration Levels
AssigneeNorthrop Grumman Systems Corporation
InventorsXing Lan, Arturo J. Mateos, Jesse B. Tice, Rajinder R. Sandhu
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Abstract
A printed circuit board (PCB) that has been fabricated by a 3D printing process. The PCB includes a substrate printed by the 3D printing process, a plurality of stacked dielectric layers printed on the substrate by the 3D printing process, and a plurality of embedded electrical circuit components printed by the 3D printing process on and throughout the substrate and the plurality of dielectric layers. The PCB can be part of a device that operates at millimeter wave frequencies, such as a mm-wave antenna.
Claims20
A printed circuit board (PCB) that has been fabricated by a 3D printing process, said PCB comprising:
- a substrate printed by the 3D printing process;
- a plurality of stacked dielectric layers printed on the substrate by the 3D printing process;
- and
- a plurality of embedded electrical circuit components printed by the 3D printing process on and throughout the substrate and the plurality of dielectric layers.
A method for fabricating a printed circuit board (PCB) by a 3D printing process, said method comprising:
- printing a substrate by the 3D printing process;
- printing a plurality of stacked dielectric layers on the substrate by the 3D printing process;
- and
- printing a plurality of embedded electrical circuit components by the 3D printing process on and throughout the substrate and the plurality of dielectric layers.
Dependencies are inferred from the claim text.