H05K 3/4667
Characterized by using an inorganic intermediate insulating layer
Official title: {characterized by using an inorganic intermediate insulating layer}
H05K3/4667 (Characterized by using an inorganic intermediate insulating layer) appears on 115 US grants and 55 published applications in this corpus.
Search patents in H05K- Granted patents
- 115
- Published applications
- 55
- Assignees
- 56
- Inventors
- 246
- Latest grant
- 2 Jul 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 3 | 0 |
| 1983 | 1 | 0 |
| 1984 | 5 | 0 |
| 1985 | 1 | 0 |
| 1986 | 3 | 0 |
| 1987 | 3 | 0 |
| 1988 | 5 | 0 |
| 1989 | 7 | 0 |
| 1990 | 10 | 0 |
| 1991 | 5 | 0 |
| 1992 | 3 | 0 |
| 1993 | 0 | 0 |
| 1994 | 3 | 0 |
| 1995 | 3 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 5 | 2 |
| 2002 | 6 | 6 |
| 2003 | 5 | 3 |
| 2004 | 4 | 6 |
| 2005 | 2 | 3 |
| 2006 | 5 | 4 |
| 2007 | 2 | 2 |
| 2008 | 0 | 3 |
| 2009 | 0 | 3 |
| 2010 | 3 | 3 |
| 2011 | 4 | 3 |
| 2012 | 0 | 0 |
| 2013 | 0 | 2 |
| 2014 | 1 | 0 |
| 2015 | 2 | 4 |
| 2016 | 2 | 3 |
| 2017 | 2 | 1 |
| 2018 | 2 | 0 |
| 2019 | 0 | 2 |
| 2020 | 0 | 2 |
| 2021 | 0 | 2 |
| 2022 | 1 | 0 |
| 2023 | 2 | 1 |
| 2024 | 2 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Ceramic carrier substrate and power module2 Jul 2024US 12,028,974 B2Robert Bosch GmbH
- Photosensitive insulating paste and electronic component30 Jan 2024US 11,886,114 B2Murata Manufacturing Co., Ltd.
- Additive manufactured 3D electronic substrate19 Sep 2023US 11,765,839 B2Schlumberger Technology Corporation
- Composite part with integral electronic instrumentation circuit and its manufacturing method2 May 2023US 11,639,916 B2Safran
- Wiring board13 Dec 2022US 11,528,810 B2Shinko Electric Industries Co., Ltd.
- Ceramic carrier substrate and power module16 Feb 2023US 2023/0051374 A1Robert Bosch GmbH
- Wiring board5 Aug 2021US 2021/0243902 A1Shinko Electric Industries Co., Ltd.
- Photosensitive insulating paste and electronic component1 Apr 2021US 2021/0096464 A1Murata Manufacturing Co., Ltd.
- Composite part with integral electronic instrumentation circuit and its manufacturing method27 Aug 2020US 2020/0271626 A1Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Additive manufactured 3d electronic substrate16 Apr 2020US 2020/0120813 A1Schlumberger Technology Corporation
Most cited
By later US patents
- Thick film multilayer substrate185US 4,328,531 AHitachi, Ltd. · 1982
- Method for fabricating multilayer circuits128US 4,806,188 AE. I. Du Pont de Nemours and Company · 1989
- Multilayer substrate112US 7,297,627 B2Medtronic MiniMed, Inc. · 2007
- Method for forming vias in multilayer circuits94US 5,293,025 AE. I. Du Pont de Nemours and Company · 1994
- Via formation for multilayer inductive devices and other devices82US 6,207,234 B1Vishay Vitramon Incorporated · 2001