Additive manufactured 3D electronic substrate

A method of forming electronic substrates and assemblies, the method comprising:

• co-depositing a first material and a second material to form a first layer, wherein the first material is an electrically insulative material and the second material is an electrically conductive material, wherein the first material and the second material are co-deposited as powders, binders, slurries, inks, or any combination of the powders, binders, slurries and inks to form the first layer;
• sintering or curing the first layer of co-deposited materials;
• co-depositing the first material and the second material to form a second layer wherein the first material and the second material of the second layer are co-deposited as powders, binders, slurries, inks, or any combination of the powders, binders, slurries and inks to form the second layer, and wherein the second layer is co-deposited on top of the sintered or cured first layer of co-deposited materials;
• sintering or curing the second layer of co-deposited materials;
• and
• retrieving a solid electronic substrate wherein within each layer the first layer, the first material of the first layer is deposited and sintered or cured at positions having x, y, and z coordinates that are discrete from positions having different x, y, and z coordinates where the second material of the first layer is deposited and sintered or cured, wherein the first material and the second material of the first layer are sintered or cured together after the first material and the second material of the first layer are deposited, and wherein the sintered or cured first material of the first layer forms the electronic substrate and the sintered or cured second material of the first layer forms a feature in or on the electronic substrate.