Method for forming vias in multilayer circuits

A method for rapidly forming a patterned array of via holes of predetermined size in an unfired layer comprising finely divided particles of dielectric solids dispersed in an ablatable organic medium containing substantially no volatile organic solvents, the layer having a thickness of 1-2000 microns, comprising the sequential steps of:

• (a) positioning a source of YAG laser light to enable directing the laser beam to a predetermined position on the surface of the dielectric layer;
• (b) directing onto the predetermined position on the surface of the dielectric layer a plurality of YAG laser beam pulses at a rate of at least 1 kHz, the laser beam being characterized as having (1) a beam size of at least 1 mil but no greater than the predetermined size of the hole to be formed, (2) depth of focus greater than the thickness of the dielectric layer, and (3) a power level of at least 1 W, and the number of pulses being sufficient to effect complete ablation of the organic medium through the dielectric layer within area beneath the laser beam without incurring densification of the dielectric solids, thereby forming a residue of finely divided dielectric particles within the thusly formed holes;
• (c) by means of a programmed galvonometric beam positioner, repositioning the laser light source to enable directing the laser beam to a further predetermined position on the surface of the dielectric layer;
• and
• (d) repeating the sequence of steps (b) and (c) at the rate of at least 50 times per second to form the patterned array of holes in the unfired layer;
• in which the rate of forming the via holes in the patterned array is optimized by drilling the via holes in a sequence determined by application of an heuristic algorithm of the symmetric traveling salesman problem.