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US 4,806,188 AGranted
Method for fabricating multilayer circuits
AssigneeE. I. Du Pont de Nemours and Company
InventorJoseph R. Rellick
Life of this patent
Estimating the term…
Abstract
The invention is directed to a method for fabricating multilayer circuits on rigid substrates using conventional dielectric green tape and thick film conductive pastes while maintaining excellent X-Y dimensional stability.
Claims8
A method for the fabrication of multilayer circuits comprising the sequential steps of:
- (a) providing a dimensionally stable electrically insulative substrate;
- (b) applying to the substrate a patterned conductive layer;
- (c) firing the patterned conductive layer;
- (d) laminating to the fired patterned conductive layer and exposed areas of the substrate a layer of dielectric green tape;
- (e) forming vias in selected positions through the layer of dielectric green tape in registration with the fired patterned conductive layer of step (c);
- (f) firing the laminated dielectric green tape layer;
- (g) filling the vias in the dielectric tape layer with a conductive metallization;
- (h) firing the filled vias in the dielectric tape layer;
- (i) applying a patterned conductive layer to the dielectric tape layer in registry with the vias therein;
- (j) firing the patterned conductive layer;
- and
- (k) in the event the multilayer circuit requires more than two layers having conductive patterns, repeating the sequence of steps (d) through (j) until the desired number of circuit layers has been obtained.
9 more elements
A method for the fabrication of multilayer circuits comprising the sequential steps of:
- (a) providing a dimensionally stable substrate;
- (b) laminating to a surface of the substrate a layer of dielectric green tape;
- (c) optionally forming vias in the laminated green tape;
- (d) firing the laminated dielectric green tape layer;
- (e) filling any vias in the laminated dielectric tape with a conductive metallization;
- (f) firing any filled vias in the dielectric tape layer;
- (g) applying to the dielectric tape layer a patterned conductive layer;
- (h) firing the patterned conductive layer;
- (i) laminating a dielectric green tape layer to the fired patterned conductive layer and exposed areas of the underlying dielectric tape layer;
- (j) forming vias in the laminated green tape layer of step (i);
- (k) firing the laminated green tape layer which was applied in step (j);
- (l) filling the vias in the dielectric tape layer with a conductive metallization;
- (m) firing the filled vias contained in the dielectric tape layer from step (1);
- (n) applying to the dielectric tape layer a patterned conductive layer;
- (o) firing the patterned conductive layer from step (n);
- and
- (p) in the event the multilayer circuit requires more than two layers having conductive patterns, repeating the sequence of steps (i) through (o) until the desired number of circuit layers has been obtained.
14 more elements
Dependencies are inferred from the claim text.