Wiring board
AssigneeShinko Electric Industries Co., Ltd.
InventorsYoko Nakabayashi, Yuta Sakaguchi
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Abstract
A wiring board includes: an insulating layer; and a connection terminal formed on the insulating layer. The connection terminal includes a first metal layer laminated on the insulating layer, a second metal layer laminated on the first metal layer, a metal pad laminated on the second metal layer, and a surface treatment layer that covers an upper surface and a side surface of the pad and that is in contact with the upper surface of the insulating layer. An end portion of the second metal layer is in contact with the surface treatment layer, and an end portion of the first metal layer is positioned closer to a center side of the pad than the end portion of the second metal layer is to form a gap between the end portion of the first metal layer and the surface treatment layer.
Claims4
A wiring board comprising:
- an insulating layer;
- and
- a connection terminal formed on an upper surface of the insulating layer, wherein
- the connection terminal includes
- a first metal layer laminated on the upper surface of the insulating
- a second metal layer laminated on an per surface of the first metal layer,
- a metal pad laminated on an upper surface of the second metal layer, and
- a surface treatment layer that covers an upper surface and a side surface of the pad and that is in contact with the upper surface of the insulating layer,
- an end portion of the second metal layer is in contact with the surface treatment layer, and
- an end portion of the first metal layer is positioned closer to a center side of the pad than the end portion of the second metal layer is to form a gap between the end Portion of the first metal layer and the surface treatment layer.
Dependencies are inferred from the claim text.