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US 2020/0120813 A1Published application
Additive manufactured 3d electronic substrate
AssigneeSchlumberger Technology Corporation
InventorsSteven O. Dunford, Mark Kostinovsky, Suriyakan Kleitz, Man To, Lweness Mazari
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Abstract
A method of forming electronic substrates and assemblies is provided. The method includes depositing a material. The material is deposited as a powder or slurry. The method includes sintering the material, and retrieving an article, including a solid electronic substrate. Also provided are electronic substrates formed by additive manufacturing, and methods of deploying the same.
Claims20
A method of forming electronic substrates and assemblies, the method comprising:
- co-depositing electrically insulative and electrically conductive materials, wherein the materials are deposited as powders, binders, slurries, inks, or combinations thereof;
- sintering the co-deposited materials;
- and
- retrieving a solid electronic substrate.
1 more element
Dependencies are inferred from the claim text.