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US 2026/0304645 A1Published application
Forming a circuit bearing structure with particle-free metal ink
AssigneeLCP Medical Technologies, Inc.
InventorJames Rathburn
Life of this patent
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Abstract
Embodiments for a method of forming a circuit bearing structure are provided. The method includes coating a first surface of a dielectric layer of a substrate with particle-free metal ink and sintering the particle-free metal ink to form a metal layer on the first surface of the dielectric layer.
Claims24
A method of forming a circuit bearing structure, the method comprising:
- providing a substrate having a dielectric layer defining a first surface;
- coating the first surface of the dielectric layer with particle-free metal ink;
- and
- sintering the particle-free metal ink to form a metal layer on the first surface of the dielectric layer.
1 more element
A method of forming a circuit bearing structure, the method comprising:
- providing a substrate having a dielectric layer and a copper layer on a first surface of the dielectric layer, wherein the copper layer is less than 10 microns thick;
- placing a resist layer on the copper layer;
- imaging and stripping the resist layer to expose the copper layer in areas corresponding to circuit features;
- etching the copper layer that is exposed by the resist layer to expose the dielectric layer in areas corresponding to the circuit features;
- ablating the dielectric with a laser to form recesses in the dielectric layer in the areas corresponding to the circuit features, wherein a power and a wavelength of the laser are set such that the laser does not ablate the copper layer;
- coating surfaces of the recesses with particle-free metal ink;
- sintering the particle-free metal ink to form a metal layer on surfaces of the recesses;
- adding additional metal to the recesses to form circuit features in the recesses;
- and
- etching the metal layer on the first surface of the dielectric layer outside of the recesses such that metal does not extend on the first surface of the dielectric layer between adjacent circuit features.
7 more elements
A method of forming a circuit bearing structure, the method comprising:
- providing a substrate having a dielectric layer and a copper layer on a first surface of the dielectric layer, wherein the copper layer is less than 10 microns thick;
- placing a resist layer on the copper layer;
- imaging and stripping the resist layer to form recesses in the resist layer and expose the copper layer in areas corresponding to circuit features;
- placing particle-free metal ink in the recesses and sintering the particle-free metal ink to form circuit features;
- removing remaining portions of the resist layer on the metal layer;
- and
- etching the metal layer on the first surface of the dielectric layer outside of the recesses such that metal does not extend on the first surface of the dielectric layer between adjacent circuit features.
4 more elements
Dependencies are inferred from the claim text.